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LM3S1332-EQC50-A2

Texas Instruments

LM3S1332-EQC50-A2 by Texas Instruments

LM3S1332-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 98304 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 105 °C, it offers high performance in compact FLATPACK package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,114 parts In-Stock

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Digiode

USA . 2,623 parts In-Stock

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2,623

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Distributors (Availability)

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AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$10.550

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341

$10.550

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One Stop Electronics

USA . 207 parts In-Stock

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$26.000

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207

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Parana Technologies

USA . 2,270 parts In-Stock

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$42.967

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$42.967

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DigiPath Technology Company

USA . 1,059 parts In-Stock

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$47.312

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1,059

$47.312

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ChromeModa Solutions

Germany . 5,811 parts In-Stock

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$48.278

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$39.588

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5,811

$48.278

$39.588

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IDEA Electronic Components Group

UK . 1,464 parts In-Stock

1+ parts

$48.278

100+ parts

$45.864

1k+ parts

$43.450

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1,464

$48.278

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$43.450

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Microchip USA

USA . 204 parts In-Stock

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Corphita

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Overview

Experience the power of innovation with the LM3S1332-EQC50-A2 by Texas Instruments, a cutting-edge microcontroller designed to exceed your expectations. Crafted by the industry leader in semiconductor technology, this versatile device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and flexibility. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life. Choose the LM3S1332-EQC50-A2 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to harsh environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, ensuring reliability and longevity of the product.

Package Shape: SQUARE

Square package shape allows for easier handling and placement on the PCB.

Bit Size: 32

32-bit architecture provides high computational power and performance for complex applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in system integration.

No. of Terminals: 100

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style allows for easy integration into a variety of electronic devices.

Minimum Supply Voltage: 2.25 V

Wide operating voltage range ensures compatibility with various power sources.

Maximum Operating Temperature: 105 °C

High operating temperature range suitable for industrial applications and harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold conditions.

ADC Channels: YES

Built-in ADC channels for analog sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position for easy soldering and PCB layout.

ROM Words: 98304

Large ROM memory size for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

Width: 14 mm

Compact width size for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient data processing.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature conditions and harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for efficient and high-performance computing.

RAM Bytes: 16384

Sufficient RAM memory for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high reliability.

Terminal Form: GULL WING

Gull wing terminal form for easy and reliable soldering connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Built-in PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash programmable memory for easy software updates and reprogramming.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs.

Speed: 50 rpm

High processing speed for real-time applications and time-critical tasks.

No. of I/O Lines: 57

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1332-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1332-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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