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LM3S1165-EQC50-A2T

Texas Instruments

LM3S1165-EQC50-A2T by Texas Instruments

Texas Instruments LM3S1165-EQC50-A2T is a 32-bit microcontroller with 65536 ROM words and 16384 RAM bytes. Operating at up to 0.032 MHz, it features 43 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,605 parts In-Stock

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4,605

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Digiode

USA . 3,010 parts In-Stock

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3,010

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Distributors (Availability)

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One Stop Electronics

USA . 379 parts In-Stock

1+ parts

$11.000

100+ parts

-

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379

$11.000

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AZTECH Wire

Italy . 484 parts In-Stock

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$18.231

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484

$18.231

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Parana Technologies

USA . 166 parts In-Stock

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$54.915

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166

$54.915

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DigiPath Technology Company

USA . 1,968 parts In-Stock

1+ parts

$60.468

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$55.631

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1,968

$60.468

$55.631

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IDEA Electronic Components Group

UK . 1,920 parts In-Stock

1+ parts

$61.702

100+ parts

$58.617

1k+ parts

$55.532

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1,920

$61.702

$58.617

$55.532

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ChromeModa Solutions

Germany . 603 parts In-Stock

1+ parts

$61.702

100+ parts

$50.596

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603

$61.702

$50.596

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Corphita

USA . 4,261 parts In-Stock

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Microchip USA

USA . 173 parts In-Stock

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Overview

Unlock the potential of your next project with the LM3S1165-EQC50-A2T microcontroller from Texas Instruments. With a reputation for excellence and innovation, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and reliability. Whether you're designing a cutting-edge IoT device or a high-tech automation system, the LM3S1165-EQC50-A2T has everything you need to bring your ideas to life. Experience the value, benefits, and advantages of this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external elements, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller is suitable for low power applications and can help in reducing energy consumption.

Package Shape: SQUARE

The square package shape provides uniformity and symmetry, making it easier to integrate the microcontroller into design layouts.

Bit Size: 32

A 32-bit architecture allows for higher processing capabilities and improved performance for complex calculations and tasks.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with various systems and components.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals, sensors, and external devices, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK

The FLATPACK package style offers a slim profile, making it suitable for space-constrained applications where height is a concern.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V allows the microcontroller to operate efficiently even under low power conditions, ensuring reliability.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microcontroller can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 105°C ensures reliable operation in extreme hot and cold environments.

ADC Channels: YES

Built-in ADC channels enable accurate analog-to-digital conversion, making the microcontroller suitable for applications requiring sensor interfacing.

Terminal Position: QUAD

A quad terminal position provides better mechanical stability and easier soldering during PCB assembly, enhancing overall reliability.

ROM Words: 65536

The large ROM size of 65536 words allows for ample storage of program instructions and data, enabling complex algorithms to be implemented.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm is ideal for applications with height constraints, ensuring compatibility with compact designs.

Width: 14 mm

The 14mm width provides a compact form factor, making it suitable for small-scale applications where space is limited.

Maximum Clock Frequency: 0.032 MHz

A maximum clock frequency of 32kHz allows for efficient processing and execution of instructions, enabling high-performance operation.

Length: 14 mm

The 14mm length offers a balanced aspect ratio, allowing for easy integration and placement within electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller architecture ensures efficient processing and execution of instructions, making it suitable for real-time applications.

RAM Bytes: 16384

With a RAM capacity of 16384 bytes, the microcontroller can efficiently store and access data during runtime, enhancing system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability during PCB assembly, ensuring secure connections and durability.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5V ensures stable and consistent power delivery to the microcontroller, preventing voltage fluctuations.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, making the microcontroller suitable for applications requiring modulation and control.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy and quick updates of firmware and software, ensuring flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm offers high-density integration and compact layout options, suitable for miniaturized electronic devices.

Speed: 50 rpm

With a maximum speed of 50rpm, the microcontroller can process instructions and data at a fast rate, ensuring responsive performance.

No. of I/O Lines: 43

Having 43 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers LM3S1165-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1165-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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