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LM3S1162-IBZ50-A2

Texas Instruments

LM3S1162-IBZ50-A2 by Texas Instruments

LM3S1162-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 8.192 MHz. It features 46 I/O lines, FLASH ROM programmability, and PWM channels, making it ideal for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,929 parts In-Stock

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Digiode

USA . 4,712 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 842 parts In-Stock

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$15.739

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842

$15.739

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One Stop Electronics

USA . 1,048 parts In-Stock

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$24.000

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1,048

$24.000

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Advanced Electronics

New Zealand . 49 parts In-Stock

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$37.238

100+ parts

$33.887

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$30.535

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49

$37.238

$33.887

$30.535

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Parana Technologies

USA . 1,838 parts In-Stock

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$41.547

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DigiPath Technology Company

USA . 333 parts In-Stock

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$45.748

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$42.088

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333

$45.748

$42.088

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Microchip USA

USA . 2,598 parts In-Stock

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$45.980

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$45.320

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$44.990

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$44.670

2,598

$45.980

$45.320

$44.990

$44.670

ChromeModa Solutions

Germany . 5,169 parts In-Stock

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$46.682

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$38.279

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IDEA Electronic Components Group

UK . 1,431 parts In-Stock

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$46.682

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$44.348

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$42.014

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$46.682

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$42.014

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Corphita

USA . 667 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S1162-IBZ50-A2 microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology to meet the demands of various applications. This versatile microcontroller offers unmatched value, providing customers with seamless integration, enhanced performance, and advanced features. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the LM3S1162-IBZ50-A2 is the perfect solution to bring your ideas to life. Experience the benefits of Texas Instruments' expertise and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Ensures safe operation and prevents damage from overvoltage.

Package Shape: SQUARE

Efficient use of space on the circuit board.

Bit Size: 32

High precision and performance capabilities.

Power Supplies (V): 2.5,3.3

Versatile power options for different applications.

No. of Terminals: 108

Sufficient connections for interfacing with other components.

Package Style (Meter): GRID ARRAY

Provides a stable mechanical connection to the circuit board.

Minimum Supply Voltage: 2.25 V

Allows for operation at lower voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures.

Terminal Finish: TIN SILVER COPPER

Ensures reliable electrical connections and corrosion resistance.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing.

Terminal Position: BOTTOM

Facilitates easy PCB layout and component placement.

ROM Words: 65536

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design for compact devices.

Width: 10 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 8.192 MHz

High-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Meets industry standard reflow soldering requirements.

Length: 10 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing.

RAM Bytes: 16384

Sufficient memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Allows for easy soldering and rework.

Nominal Supply Voltage: 2.5 V

Stable voltage supply for consistent performance.

PWM Channels: YES

Enables precise control of pulse-width modulation signals.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware.

Terminal Pitch: 0.8 mm

Provides sufficient spacing for reliable solder joints.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate exposure to moisture during storage and handling.

Speed: 50 rpm

High-speed operation for responsive performance.

No. of I/O Lines: 46

Sufficient input/output connections for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1162-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1162-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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