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LM3S1150-IBZ50-A2T

Texas Instruments

LM3S1150-IBZ50-A2T by Texas Instruments

LM3S1150-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 52 I/O lines, 16384 bytes of RAM, and ROM programmability for industrial applications requiring high-speed processing and PWM control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,549 parts In-Stock

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5,549

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Digiode

USA . 3,410 parts In-Stock

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3,410

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Distributors (Availability)

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AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$5.297

100+ parts

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674

$5.297

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One Stop Electronics

USA . 1,058 parts In-Stock

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$12.000

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1,058

$12.000

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Advanced Electronics

New Zealand . 16 parts In-Stock

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$47.394

100+ parts

$43.129

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$38.863

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16

$47.394

$43.129

$38.863

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Microchip USA

USA . 3,034 parts In-Stock

1+ parts

$51.360

100+ parts

$50.620

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$50.260

10k+ parts

$49.890

3,034

$51.360

$50.620

$50.260

$49.890

Parana Technologies

USA . 439 parts In-Stock

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$57.512

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439

$57.512

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DigiPath Technology Company

USA . 1,137 parts In-Stock

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$63.328

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1,137

$63.328

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ChromeModa Solutions

Germany . 6,009 parts In-Stock

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$64.620

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$52.988

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6,009

$64.620

$52.988

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IDEA Electronic Components Group

UK . 1,746 parts In-Stock

1+ parts

$64.620

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$61.389

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$58.158

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1,746

$64.620

$61.389

$58.158

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Corphita

USA . 612 parts In-Stock

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612

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Overview

Experience cutting-edge technology with the Texas Instruments LM3S1150-IBZ50-A2T microcontroller, setting the standard for quality and innovation in the industry. Designed with precision and reliability in mind, this product offers a wide range of applications in various fields, providing customers with unparalleled value and performance. Unlock the potential of your projects with the advanced features and benefits of this microcontroller, delivering smooth operation and seamless integration for all your electronic needs. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external elements, making it suitable for various environments.

Surface Mount: YES

Surface mount design makes the microcontroller easy to integrate onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage of 2.75V ensures efficient power consumption and helps in reducing overall power usage.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy handling during assembly.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex tasks and process data efficiently.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in design and compatibility with different systems.

No. of Terminals: 108

Having 108 terminals allows for a wide range of connectivity options and interfaces for peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and connectivity, making it suitable for applications requiring a large number of I/O lines.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage of 2.25V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the microcontroller can function in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microcontroller to operate in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and long-term reliability for the connections.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels enables the microcontroller to convert analog signals into digital data for processing.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy soldering and connection to the PCB, enhancing the overall reliability of the system.

ROM Words: 65536

The large ROM size of 65536 words allows for storing significant amounts of program data and code for execution.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5mm enables slim and compact designs, ideal for space-constrained applications.

Width: 10 mm

The compact width of 10mm ensures the microcontroller can fit into small spaces and tight PCB layouts.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows for fast processing and efficient operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand reflow soldering processes without any issues.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and assembly of the microcontroller onto PCBs.

Length: 10 mm

The compact length of 10mm allows for efficient use of space on the PCB and easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating makes the microcontroller suitable for rugged industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral IC types, this product offers optimized processing performance and efficient operation.

RAM Bytes: 16384

With a RAM size of 16384 bytes, the microcontroller can efficiently store and access data during processing tasks.

Technology: CMOS

The CMOS technology used in the microcontroller provides low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: BALL

The terminal form of ball ensures reliable connections and solder joints, improving the overall durability and performance of the microcontroller.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides stable power input for the microcontroller, ensuring consistent performance and reliability.

PWM Channels: YES

The presence of PWM (Pulse Width Modulation) channels allows the microcontroller to generate precise and accurate analog voltage levels for motor control and other applications.

ROM Programmability: FLASH

The ROM programmability using Flash technology enables easy reprogramming of the microcontroller without the need for specialized equipment or external programming devices.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the microcontroller can be easily mounted onto PCBs with fine pitch components, ensuring compatibility with modern assembly processes.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller can withstand multiple reflow soldering cycles without undergoing moisture-related issues, ensuring long-term reliability.

Speed: 50 rpm

The operating speed of 50 rpm allows the microcontroller to execute instructions and processes data at a high rate, ensuring efficient performance in various applications.

No. of I/O Lines: 52

Having 52 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile and suitable for a wide range of applications.

Technical Specifications

Microcontrollers LM3S1150-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1150-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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