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LM3S1150-EQC50-A2

Texas Instruments

LM3S1150-EQC50-A2 by Texas Instruments

LM3S1150-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 52 I/O lines, 16384 RAM bytes, and 65536 ROM words. It operates in industrial temperatures (-40 to 105 °C) and features PWM channels for various applications. With a max clock frequency of 0.032 MHz, it is suitable for embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,506 parts In-Stock

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Digiode

USA . 404 parts In-Stock

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404

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AZTECH Wire

Italy . 740 parts In-Stock

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$14.079

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740

$14.079

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One Stop Electronics

USA . 1,257 parts In-Stock

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$20.000

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Parana Technologies

USA . 2,012 parts In-Stock

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$39.575

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$39.575

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DigiPath Technology Company

USA . 769 parts In-Stock

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$43.577

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769

$43.577

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ChromeModa Solutions

Germany . 2,601 parts In-Stock

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$44.466

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$36.462

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$44.466

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IDEA Electronic Components Group

UK . 1,336 parts In-Stock

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$44.466

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$42.243

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$40.019

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1,336

$44.466

$42.243

$40.019

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Corphita

USA . 2,195 parts In-Stock

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Microchip USA

USA . 198 parts In-Stock

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Overview

Experience the power of innovation with the LM3S1150-EQC50-A2 microcontroller by Texas Instruments. Designed to deliver exceptional performance and reliability, this cutting-edge device is a game-changer in the world of microcontrollers. Perfect for a wide range of applications, from industrial automation to consumer electronics, the LM3S1150-EQC50-A2 offers unparalleled value and benefits to customers. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with this advanced microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on a PCB, saving space and facilitating mass production.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Simplifies PCB layout and integration into electronic systems.

Bit Size: 32

Offers high computational capability for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options for different applications.

No. of Terminals: 100

Offers ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Enhances thermal performance and reliability of the microcontroller.

Minimum Supply Voltage: 2.25 V

Wide range of supply voltage ensures stable operation in various conditions.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Facilitates easy PCB layout and routing of connections.

ROM Words: 65536

Offers ample memory capacity for program storage and data handling.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

Width: 14 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and real-time applications.

Length: 14 mm

Compact form factor for space-efficient PCB design.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for fast execution and power efficiency.

RAM Bytes: 16384

Sufficient random access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Secure solder joints and reliable connections to the PCB.

Nominal Supply Voltage: 2.5 V

Standard voltage level for compatibility with various power sources.

PWM Channels: YES

Supports pulse-width modulation for controlling motor speed and other applications.

ROM Programmability: FLASH

Allows for reprogramming of the ROM for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB design and space savings.

Speed: 50 rpm

Capable of handling high-speed operations and data processing.

No. of I/O Lines: 52

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1150-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1150-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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