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LM3S1138-IQC50-A2

Texas Instruments

LM3S1138-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1138-IQC50-A2 microcontroller features 32-bit CPU, 16384 bytes RAM, and 8-channel 10-bit ADC. Ideal for industrial applications requiring low power consumption, it offers connectivity through I2C(2), SSI(2), UART(3) interfaces. With a max clock frequency of 8.192 MHz, this Cortex-M3 family device is suitable for embedded systems design.

Median Price

$22.365

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$19.880

1k+ parts

$17.790

10k+ parts

$16.740

500

-

$19.880

$17.790

$16.740

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$24.850

1k+ parts

$22.238

10k+ parts

$20.925

90

-

$24.850

$22.238

$20.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,294 parts In-Stock

1+ parts

$20.995

100+ parts

-

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1,294

$20.995

-

-

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Vyrian

USA . 3,923 parts In-Stock

1+ parts

-

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3,923

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-

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DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

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Corphita

USA . 2,751 parts In-Stock

1+ parts

$19.890

100+ parts

-

1k+ parts

-

10k+ parts

-

2,751

$19.890

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$50.332

100+ parts

$45.802

1k+ parts

$41.272

10k+ parts

-

50

$50.332

$45.802

$41.272

-

Microchip USA

USA . 1,064 parts In-Stock

1+ parts

$58.410

100+ parts

$57.390

1k+ parts

$56.880

10k+ parts

$56.370

1,064

$58.410

$57.390

$56.880

$56.370

Parana Technologies

USA . 335 parts In-Stock

1+ parts

$63.708

100+ parts

-

1k+ parts

-

10k+ parts

-

335

$63.708

-

-

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DigiPath Technology Company

USA . 936 parts In-Stock

1+ parts

$70.150

100+ parts

$64.538

1k+ parts

-

10k+ parts

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936

$70.150

$64.538

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-

ChromeModa Solutions

Germany . 5,201 parts In-Stock

1+ parts

$71.582

100+ parts

$58.697

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-

10k+ parts

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5,201

$71.582

$58.697

-

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IDEA Electronic Components Group

UK . 904 parts In-Stock

1+ parts

$71.582

100+ parts

$68.003

1k+ parts

$64.424

10k+ parts

-

904

$71.582

$68.003

$64.424

-

Authorized Procurement Solutions

USA . 22,500 parts In-Stock

1+ parts

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22,500

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

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7,500

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 458 parts In-Stock

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458

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Perfect Parts

USA . 448 parts In-Stock

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448

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ChipstoGo Electronic ltd

UK . 38 parts In-Stock

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38

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments LM3S1138-IQC50-A2 microcontroller. Designed to deliver unmatched performance and reliability, this versatile device is perfect for a wide range of applications. With advanced features like integrated cache and low power mode, this microcontroller offers unparalleled value and benefits to customers. Whether you're working on a personal project or a professional endeavor, trust Texas Instruments to provide top-of-the-line quality and innovation in every product. Experience the difference with the LM3S1138-IQC50-A2 microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache enhances the performance of the microcontroller by storing frequently used data and instructions, reducing access time and improving efficiency.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation within specified limits, protecting the microcontroller from electrical damage.

On Chip Data RAM Width: 8

The wide data RAM width of 8 bits allows for faster data processing and manipulation, improving overall performance.

Package Shape: SQUARE

The square package shape is compact and allows for efficient placement on PCBs, making it suitable for space-constrained designs.

Bit Size: 32

The 32-bit architecture provides enhanced computing power and capability, making the microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2.5, 3.3

The availability of multiple power supply options makes the microcontroller versatile and compatible with different voltage requirements in various systems.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity options and integration with a wide range of peripherals and components.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile and compact footprint, ideal for applications where space is limited or height constraints exist.

Technical Specifications

Microcontrollers LM3S1138-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

44

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1138-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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