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LM3S1133-EQC50-A2T

Texas Instruments

LM3S1133-EQC50-A2T by Texas Instruments

LM3S1133-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 44 I/O lines, 16KB RAM, and 64KB ROM. It operates b/w -40 to 105°C and has a clock frequency of up to 8.192 MHz. Ideal for industrial applications requiring high-speed processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,145 parts In-Stock

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3,145

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Digiode

USA . 1,088 parts In-Stock

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1,088

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Distributors (Availability)

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AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$14.029

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838

$14.029

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One Stop Electronics

USA . 1,137 parts In-Stock

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$27.000

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$27.000

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Parana Technologies

USA . 47 parts In-Stock

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$56.975

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47

$56.975

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DigiPath Technology Company

USA . 430 parts In-Stock

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$62.737

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430

$62.737

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IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$64.017

100+ parts

$60.816

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$57.615

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1,985

$64.017

$60.816

$57.615

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ChromeModa Solutions

Germany . 1,847 parts In-Stock

1+ parts

$64.017

100+ parts

$52.494

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1,847

$64.017

$52.494

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Corphita

USA . 707 parts In-Stock

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707

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Microchip USA

USA . 309 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S1133-EQC50-A2T microcontroller. This versatile device offers a wide range of applications, from industrial automation to consumer electronics. With a powerful 32-bit processor and a variety of peripherals, this microcontroller delivers exceptional performance and efficiency. Trust in the quality and reliability of Texas Instruments to bring innovative solutions to your projects. Unlock the full potential of your designs with the LM3S1133-EQC50-A2T microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75V, making it suitable for low voltage applications.

Package Shape: SQUARE

Square package shape enables easier integration into circuit designs and provides a symmetric form factor.

Bit Size: 32

32-bit architecture allows for higher computational capabilities and performance compared to lower bit microcontrollers.

Power Supplies (V): 2.5, 3.3

Supports multiple power supply options, offering flexibility in design and compatibility with different voltage sources.

No. of Terminals: 100

Large number of terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact and low-profile form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Maintains stable operation even at low minimum supply voltage, ensuring reliable performance in varying power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for operation in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold environments, making it suitable for diverse applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, facilitating sensor interfacing and data acquisition tasks.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and soldering processes, enhancing ease of assembly and maintenance.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program code and data, enabling complex applications to be executed.

Maximum Seated Height: 1.6 mm

Low seated height reduces the overall profile of the microcontroller, making it suitable for slim and compact device designs.

Width: 14 mm

Standard width dimension facilitates compatibility with common PCB layouts and mounting configurations.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency enables fast data processing and execution of time-critical tasks, improving overall system performance.

Length: 14 mm

Compact length dimension enables efficient space utilization on the PCB, allowing for denser component placement.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and stability in demanding operating environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture-based microcontroller offers efficient instruction execution and reduced power consumption, enhancing overall system efficiency.

RAM Bytes: 16384

Large RAM capacity provides ample memory for data storage and processing, enabling efficient multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy-efficient operation and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and improves solder joint reliability, enhancing overall system robustness.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation under normal operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of pulse-width modulated signals, ideal for motor control and power regulation applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexibility in updating firmware and program code, facilitating product enhancement and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB routing and compact design implementations, saving space and reducing signal interference.

Speed: 50 rpm

High speed capability of 50rpm allows for fast data processing and responsive system performance, suitable for real-time applications.

No. of I/O Lines: 44

Abundant I/O lines provide versatile connectivity options for interfacing with external devices and peripherals, enhancing system functionality.

Technical Specifications

Microcontrollers LM3S1133-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

44

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1133-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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