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LM3S1110-IBZ25-A2T

Texas Instruments

LM3S1110-IBZ25-A2T by Texas Instruments

Texas Instruments' LM3S1110-IBZ25-A2T microcontroller features 32-bit architecture, 108 terminals, and 65536 ROM words. Ideal for industrial applications, it operates b/w -40 to 85°C with a clock frequency of 0.032 MHz. With PWM channels and ADC support, this CMOS device is suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,654 parts In-Stock

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Digiode

USA . 1,613 parts In-Stock

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1,613

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Distributors (Availability)

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AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$8.206

100+ parts

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209

$8.206

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One Stop Electronics

USA . 951 parts In-Stock

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$11.000

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951

$11.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$16.905

100+ parts

$15.384

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$13.862

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3,000

$16.905

$15.384

$13.862

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Parana Technologies

USA . 35 parts In-Stock

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$17.642

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$17.834

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35

$17.642

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$17.834

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DigiPath Technology Company

USA . 1,062 parts In-Stock

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$19.427

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$17.872

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1,062

$19.427

$17.872

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$19.823

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$18.832

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$17.841

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2,016

$19.823

$18.832

$17.841

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ChromeModa Solutions

Germany . 264 parts In-Stock

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$19.823

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$16.255

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264

$19.823

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Microchip USA

USA . 2,362 parts In-Stock

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$38.790

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$38.240

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$37.960

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$37.680

2,362

$38.790

$38.240

$37.960

$37.680

Corphita

USA . 2,910 parts In-Stock

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Overview

Experience the innovative power of Texas Instruments with the LM3S1110-IBZ25-A2T microcontroller. This cutting-edge device offers unmatched quality and reliability, making it the perfect solution for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides exceptional performance and efficiency. With its advanced features and robust design, the LM3S1110-IBZ25-A2T delivers unparalleled value and benefits to customers looking for top-notch technology. Trust Texas Instruments to bring you the best in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, saving space on the PCB.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

Square package shape is easy to handle and provides better alignment during assembly.

Bit Size: 32

32-bit architecture allows for higher processing capability and efficiency in executing instructions.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages provides flexibility in different application scenarios.

No. of Terminals: 108

Having a high number of terminals allows for various connectivity options and peripherals to be added.

Package Style (Meter): GRID ARRAY

Grid array package style enables easy soldering and maintenance of the microcontroller.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures stable operation even in fluctuating power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the microcontroller suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Triple-layer terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, making the microcontroller versatile in sensor applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing of traces for efficient design.

ROM Words: 65536

Large ROM capacity allows for storing a vast amount of program data and instructions.

Maximum Seated Height: 1.5 mm

Low seated height enables compact design without sacrificing performance.

Width: 10 mm

Compact width makes the microcontroller suitable for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for faster processing and real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability of connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust solder joints during assembly.

Length: 10 mm

Compact length contributes to a small form factor and ease of integration in tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the microcontroller suitable for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enables faster execution of instructions and efficient use of resources.

RAM Bytes: 16384

Generous RAM capacity allows for efficient data storage and processing during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections during assembly and operation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability.

PWM Channels: YES

Availability of PWM channels allows for precise control of analog outputs, essential in motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy reprogramming of firmware and updates without requiring external programming tools.

Terminal Pitch: 0.8 mm

Narrow terminal pitch facilitates high-density PCB layout and miniaturization of the overall design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is suitable for standard moisture exposure levels during storage and handling.

Speed: 25 rpm

High speed capability enables fast data processing and real-time control in dynamic applications.

No. of I/O Lines: 41

Abundance of I/O lines allows for versatile interfacing with external devices and peripherals, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S1110-IBZ25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1110-IBZ25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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