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LM3S102-IGZ20-C2T

Texas Instruments

LM3S102-IGZ20-C2T by Texas Instruments

LM3S102-IGZ20-C2T by Texas Instruments is a 32-bit microcontroller with 2048 bytes of RAM and 8192 ROM words. Operating at a max clock frequency of 0.032 MHz, it features 18 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control. With a temperature range from -40 to 105 °C, this chip carrier package microcontroller is suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,893 parts In-Stock

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Digiode

USA . 2,609 parts In-Stock

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2,609

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Distributors (Availability)

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$7.580

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324

$7.580

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One Stop Electronics

USA . 733 parts In-Stock

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$20.000

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733

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Parana Technologies

USA . 2,205 parts In-Stock

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$24.617

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$25.280

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$24.617

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$25.280

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DigiPath Technology Company

USA . 1,301 parts In-Stock

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$27.107

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$24.938

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1,301

$27.107

$24.938

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ChromeModa Solutions

Germany . 3,275 parts In-Stock

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$27.660

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$22.681

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3,275

$27.660

$22.681

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$27.660

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$26.277

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$24.894

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592

$27.660

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$24.894

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Corphita

USA . 3,297 parts In-Stock

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Microchip USA

USA . 1,157 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S102-IGZ20-C2T microcontroller by Texas Instruments. Designed for industrial-grade applications, this high-quality chip carrier offers reliable performance and advanced features. With a 32-bit architecture, 2048 bytes of RAM, and 8192 ROM words, this microcontroller delivers exceptional speed and efficiency. Whether you're developing IoT devices, robotics, or automation systems, the LM3S102-IGZ20-C2T provides the value, flexibility, and reliability you need to bring your projects to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging makes installation easier and more convenient, saving time and effort.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, making the product versatile and compatible with different power sources.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation.

Bit Size: 32

High bit size allows for complex operations and calculations, suitable for demanding applications.

Power Supplies (V): 3.3

Stable and common power supply voltage that ensures reliability and compatibility with various systems.

No. of Terminals: 48

Sufficient number of terminals for versatile connectivity and interface options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compactness and efficiency in design, saving space on the circuit board.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement allows for efficient power consumption and operation.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliability in various environmental conditions, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, making it suitable for applications in cold environments.

ADC Channels: YES

Analog-to-digital conversion channels enable the product to measure and process analog signals, expanding its usability.

Terminal Position: QUAD

Quad terminal position ensures easy and secure connection for stable performance.

ROM Words: 8192

Generous ROM size allows for storage of program instructions and data for efficient operation.

Maximum Seated Height: 1 mm

Low seated height offers a slim profile and compact design, ideal for space-constrained applications.

Width: 6.875 mm

Narrow width enables the product to fit in tight spaces and compact designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing and real-time operation in demanding applications.

Length: 6.875 mm

Compact length complements the overall small form factor of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers high performance and efficiency in processing tasks.

RAM Bytes: 2048

Ample RAM size for temporary data storage and efficient multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the product's efficiency.

Terminal Form: NO LEAD

No-lead terminal form simplifies installation and reduces the risk of soldering errors.

Maximum Supply Current: 50 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable and reliable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals for varied applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact and space-efficient PCB design.

Speed: 20 rpm

Operates at a fast speed of 20 rpm, suitable for applications requiring quick response times.

No. of I/O Lines: 18

Sufficient number of I/O lines for versatile input/output configurations.

Technical Specifications

Microcontrollers LM3S102-IGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S102-IGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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