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LM3S102-EQN20-C2

Texas Instruments

LM3S102-EQN20-C2 by Texas Instruments

LM3S102-EQN20-C2 by Texas Instruments is a 32-bit microcontroller with 8192 ROM words and 2048 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is suitable for industrial applications requiring PWM channels and ADC functionality. With a package style of FLATPACK and GULL WING terminal form, this microcontroller offers versatile performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,188 parts In-Stock

1+ parts

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3,188

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Vyrian

USA . 2,760 parts In-Stock

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2,760

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,130 parts In-Stock

1+ parts

$15.000

100+ parts

-

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1,130

$15.000

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Parana Technologies

USA . 560 parts In-Stock

1+ parts

$15.015

100+ parts

-

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$15.432

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560

$15.015

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$15.432

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ChromeModa Solutions

Germany . 1,556 parts In-Stock

1+ parts

$16.871

100+ parts

$13.834

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1,556

$16.871

$13.834

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$16.871

100+ parts

$16.027

1k+ parts

$15.184

10k+ parts

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520

$16.871

$16.027

$15.184

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$18.674

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594

$18.674

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Corphita

USA . 1,977 parts In-Stock

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1,977

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Microchip USA

USA . 1,451 parts In-Stock

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1,451

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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$15.211

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1,278

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$15.211

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Overview

Unlock the power of innovation with the LM3S102-EQN20-C2 microcontroller by Texas Instruments. Built with precision and expertise, this device offers exceptional performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched value, efficiency, and versatility. Experience seamless integration, powerful features, and cutting-edge technology with the LM3S102-EQN20-C2 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a long lifespan for the product.

Surface Mount: YES

Ease of installation and compatibility with modern PCB manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within the specified voltage range.

Package Shape: SQUARE

Facilitates easy placement and mounting on PCBs, optimizing space usage.

Bit Size: 32

Provides processing power suitable for a wide range of applications, from simple tasks to more complex operations.

Power Supplies (V): 3.3

Commonly used voltage level, ensuring compatibility with standard power sources.

No. of Terminals: 48

Sufficient number of terminals for connecting peripherals and external components, enhancing versatility and functionality.

Package Style (Meter): FLATPACK

Compact form factor suitable for space-constrained applications, providing ease of integration.

Minimum Supply Voltage: 3 V

Tolerance for lower voltage input, allowing for operation in varying power conditions.

Maximum Operating Temperature: 105 °C

Capability to withstand high temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Ability to operate in low-temperature conditions, ensuring reliability in cold environments.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and inputs.

Terminal Position: QUAD

Arrangement of terminals facilitates easy connection to external devices and components.

ROM Words: 8192

Sufficient memory capacity for storing program instructions and data, enabling complex functionality.

Maximum Seated Height: 1.6 mm

Low-profile design suitable for applications with height constraints, allowing for compact system integration.

Width: 7 mm

Compact width dimension suitable for space-efficient PCB layout and design.

Maximum Clock Frequency: 0.032 MHz

High clock frequency capability for fast processing and execution of instructions.

Length: 7 mm

Compact length dimension for efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature and humidity conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing architecture for efficient processing and performance.

RAM Bytes: 2048

Adequate random-access memory for storing and accessing data during program execution, enhancing computational capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Terminal configuration suitable for surface mount technology, ensuring secure and reliable connections.

Maximum Supply Current: 50 mA

Low supply current requirement for efficient power usage and reduced heat dissipation.

Nominal Supply Voltage: 3.3 V

Stable and standard supply voltage for consistent performance and compatibility with power sources.

PWM Channels: YES

Pulse Width Modulation channels for precise control of output signals, ideal for motor control and other applications requiring variable voltage levels.

ROM Programmability: FLASH

Flash memory technology for reprogramming and updating firmware easily and quickly.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on PCBs, enabling compact and efficient circuit designs.

Speed: 20 rpm

Fast processing speed for rapid execution of operations, improving overall system performance.

No. of I/O Lines: 18

Sufficient number of Input/Output lines for connecting to external devices and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers LM3S102-EQN20-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S102-EQN20-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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