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LM3S102-EGZ20-C2

Texas Instruments

LM3S102-EGZ20-C2 by Texas Instruments

LM3S102-EGZ20-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 8192 ROM words, and 2048 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 105°C and features ADC channels, PWM support, and a max clock frequency of 0.032 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,123 parts In-Stock

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5,123

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Digiode

USA . 2,291 parts In-Stock

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2,291

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Distributors (Availability)

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One Stop Electronics

USA . 1,231 parts In-Stock

1+ parts

$3.000

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1,231

$3.000

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AZTECH Wire

Italy . 508 parts In-Stock

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$19.116

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508

$19.116

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Parana Technologies

USA . 1,784 parts In-Stock

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$67.057

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1,784

$67.057

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DigiPath Technology Company

USA . 1,680 parts In-Stock

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$73.838

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1,680

$73.838

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ChromeModa Solutions

Germany . 4,930 parts In-Stock

1+ parts

$75.345

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$61.783

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4,930

$75.345

$61.783

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IDEA Electronic Components Group

UK . 308 parts In-Stock

1+ parts

$75.345

100+ parts

$71.578

1k+ parts

$67.810

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308

$75.345

$71.578

$67.810

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Corphita

USA . 3,115 parts In-Stock

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Microchip USA

USA . 1,876 parts In-Stock

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1,876

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Overview

Unlock the potential of your projects with the LM3S102-EGZ20-C2 microcontroller by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products for various applications. This powerful 32-bit microcontroller offers customers reliable performance, versatility, and efficiency. With features like ADC channels, PWM channels, and flash ROM programmability, this product provides extensive capabilities for your designs. Trust Texas Instruments to bring innovation and value to your projects with the LM3S102-EGZ20-C2.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for versatility in powering the microcontroller and connecting with other components in the circuit.

Package Shape: SQUARE

Square package shape ensures easy placement and alignment on the PCB, optimizing space usage.

Bit Size: 32

32-bit architecture provides enhanced computational power and efficiency for processing tasks.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation and compatibility with various electronics.

No. of Terminals: 48

48 terminals offer ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style allows for compact and reliable packaging, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

Minimum supply voltage of 3V ensures compatibility with a wide range of power sources and battery configurations.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C enables the microcontroller to withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments.

ADC Channels: YES

Integrated ADC channels enable analog data acquisition and processing, essential for sensor interfacing and measurement applications.

Terminal Position: QUAD

Quad terminal position facilitates easy and organized connection of peripheral devices, minimizing wiring complexity.

ROM Words: 8192

8192 ROM words provide sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm allows for slim and space-saving PCB designs.

Width: 6.875 mm

Narrow width of 6.875mm ensures efficient use of board space and compact footprint.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz facilitates rapid data processing and execution of instructions.

Length: 6.875 mm

Compact length of 6.875mm enables the microcontroller to fit easily within confined spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation across a wide range of temperature conditions, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller provides efficient and optimized instruction execution for enhanced performance.

RAM Bytes: 2048

2048 RAM bytes offer sufficient memory for temporary data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and enhances reliability in connection soldering.

Maximum Supply Current: 50 mA

Maximum supply current of 50mA ensures power-efficient operation and compatibility with various power sources.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable performance in different operating conditions.

PWM Channels: YES

Presence of PWM channels enables precise control of analog signals, essential for applications such as motor speed control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables high-density mounting and compact layout on the PCB.

Speed: 20 rpm

Operational speed of 20 rpm ensures efficient execution of tasks and quick response time in real-time applications.

No. of I/O Lines: 18

18 I/O lines provide versatile interfacing capabilities for connecting with external sensors, actuators, and communication peripherals.

Technical Specifications

Microcontrollers LM3S102-EGZ20-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S102-EGZ20-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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