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LM3S101-IQN20-C2

Texas Instruments

LM3S101-IQN20-C2 by Texas Instruments

LM3S101-IQN20-C2 by Texas Instruments is a 32-bit microcontroller with 2048 bytes of RAM and 8192 ROM words. Operating at a max clock frequency of 0.032 MHz, it features 18 I/O lines and PWM channels for industrial applications requiring precise control and data processing within the temperature range of -40 to 85 °C.

Median Price

$3.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 415 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.520

10k+ parts

$2.370

415

-

$2.810

$2.520

$2.370

DigiKey

USA . 415 parts In-Stock

1+ parts

-

100+ parts

$3.700

1k+ parts

-

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415

-

$3.700

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-

Verical

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.150

10k+ parts

$2.962

415

-

-

$3.150

$2.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,490 parts In-Stock

1+ parts

$2.974

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-

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1,490

$2.974

-

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Vyrian

USA . 5,829 parts In-Stock

1+ parts

-

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5,829

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Distributors (Availability)

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Corphita

USA . 2,932 parts In-Stock

1+ parts

$2.817

100+ parts

-

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2,932

$2.817

-

-

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

$30.510

100+ parts

-

1k+ parts

$69.142

10k+ parts

-

2,114

$30.510

-

$69.142

-

Microchip USA

USA . 1,608 parts In-Stock

1+ parts

$30.790

100+ parts

$30.600

1k+ parts

$30.510

10k+ parts

$30.410

1,608

$30.790

$30.600

$30.510

$30.410

DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$33.595

100+ parts

-

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-

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850

$33.595

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-

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ChromeModa Solutions

Germany . 6,593 parts In-Stock

1+ parts

$34.281

100+ parts

$28.110

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-

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6,593

$34.281

$28.110

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IDEA Electronic Components Group

UK . 702 parts In-Stock

1+ parts

$34.281

100+ parts

$32.567

1k+ parts

$30.853

10k+ parts

-

702

$34.281

$32.567

$30.853

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QUARKTWIN TECHNOLOGY LTD

USA . 17,737 parts In-Stock

1+ parts

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17,737

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your projects with the LM3S101-IQN20-C2 microcontroller from Texas Instruments, a powerhouse in the industry known for quality and reliability. This versatile device is perfect for a wide range of applications, offering customers unparalleled value with its 32-bit processing power, 2048 bytes of RAM, and 8192 ROM words. With a maximum clock frequency of 0.032 MHz and industrial-grade temperature range, this microcontroller delivers top-notch performance in a compact package. Trust Texas Instruments to provide cutting-edge technology that empowers your innovations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input options, accommodating a wider range of applications.

Bit Size: 32

32-bit architecture provides high processing power and efficiency, suitable for handling complex tasks and calculations.

No. of Terminals: 48

Having a larger number of terminals enables more connectivity options, allowing for versatile usage in various projects.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability and performance even in extreme cold conditions, making it suitable for diverse environments.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, facilitating sensor interfacing and data acquisition in embedded systems.

ROM Words: 8192

Ample ROM capacity allows for storing program instructions and data, ensuring efficient operation and program execution.

RAM Bytes: 2048

Sufficient RAM size enables temporary data storage and manipulation, supporting multitasking and efficient program execution.

PWM Channels: YES

PWM channels enable precise control of analog signals, making it ideal for applications such as motor control and LED brightness adjustment.

Technical Specifications

Microcontrollers LM3S101-IQN20-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S101-IQN20-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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