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LM3S101-EGZ20-C2T

Texas Instruments

LM3S101-EGZ20-C2T by Texas Instruments

Texas Instruments LM3S101-EGZ20-C2T is a 32-bit microcontroller with 3.3V power supply, 2048 bytes RAM, and 8192 ROM words. Ideal for industrial applications, it operates b/w -40 to 105°C with a clock frequency of 0.032 MHz. With PWM channels and ADC support, this chip carrier package suits various embedded systems requiring high-speed processing and precise control functionalities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,463 parts In-Stock

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Digiode

USA . 937 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 670 parts In-Stock

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$6.442

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$6.442

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One Stop Electronics

USA . 690 parts In-Stock

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$8.000

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$8.000

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Parana Technologies

USA . 1,627 parts In-Stock

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$74.327

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ChromeModa Solutions

Germany . 6,149 parts In-Stock

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$83.513

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$68.481

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IDEA Electronic Components Group

UK . 202 parts In-Stock

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$83.513

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$79.337

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$75.162

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202

$83.513

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DigiPath Technology Company

USA . 1,716 parts In-Stock

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$75.295

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Microchip USA

USA . 1,513 parts In-Stock

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Corphita

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Overview

Experience the next level of performance with the LM3S101-EGZ20-C2T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products that meet the highest industry standards. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its advanced features and reliability, the LM3S101-EGZ20-C2T is sure to exceed your expectations and take your projects to new heights. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and shock resistance, making the microcontroller suitable for various applications in different environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and can handle higher voltage applications.

Bit Size: 32

32-bit architecture offers enhanced processing power and performance compared to lower bit microcontrollers, suitable for complex tasks and applications.

Power Supplies (V): 3.3

Stable supply voltage of 3.3V ensures reliable operation and compatibility with many standard power sources.

No. of Terminals: 48

The ample number of terminals allows for versatile connectivity options and interfacing with other components in a system.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 to 105°C enables the microcontroller to function in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, essential for interfacing with sensors and other analog devices.

ROM Words: 8192

Large ROM capacity of 8192 words provides ample space for program storage, allowing for complex program logic and functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, maximizing performance and speed of the microcontroller.

RAM Bytes: 2048

Sufficient RAM capacity of 2048 bytes enables temporary data storage and efficient multitasking capabilities for the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance of the microcontroller.

Maximum Supply Current: 50 mA

Low supply current requirements of 50mA reduce power consumption and heat generation, prolonging the lifespan of the microcontroller.

PWM Channels: YES

Integrated PWM channels provide precise control over analog output signals, ideal for applications requiring accurate voltage or current modulation.

Technical Specifications

Microcontrollers LM3S101-EGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

6.875 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S101-EGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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