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JM38510/65604BRA

Texas Instruments

JM38510/65604BRA by Texas Instruments

JM38510/65604BRA by Texas Instruments is an 8-bit bus driver with 0.08 ns propagation delay, suitable for military applications. It operates at a supply voltage of 5V, has a max operating temperature of 125°C, and features a 3-STATE output.

Median Price

$35.008

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 1 parts In-Stock

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$11.526

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American Microsemiconductor Inc.

USA . 7 parts In-Stock

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$58.490

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Digiode

USA . 2,699 parts In-Stock

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Vyrian

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North Shore Components

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Electronics Depot

USA . 8 parts In-Stock

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Inland Empire Components Inc.

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QIE Inc.

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Resion

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Distributors (Availability)

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Andel Nordic

Denmark . 50 parts In-Stock

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$3.240

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$3.111

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$3.111

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$3.240

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$3.111

AZTECH Wire

Italy . 422 parts In-Stock

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$8.642

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Parana Technologies

USA . 976 parts In-Stock

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ChromeModa Solutions

Germany . 793 parts In-Stock

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$23.912

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IDEA Electronic Components Group

UK . 431 parts In-Stock

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One Stop Electronics

USA . 1,055 parts In-Stock

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$59.000

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Microchip USA

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Component Stockers USA

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Corphita

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DigiPath Technology Company

USA . 429 parts In-Stock

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Overview

Enhance your electronic projects with the JM38510/65604BRA by Texas Instruments, a top-quality bus driver and transceiver that delivers unmatched performance and reliability. Manufactured by the renowned Texas Instruments, this product is ideal for a wide range of applications. With its ceramic, glass-sealed package body material and MIL-M-38510 Class B screening level, this device ensures optimal functionality and durability. Experience seamless communication and efficient signal transmission with the JM38510/65604BRA, providing you with the value and benefits you need for your projects. Trust Texas Instruments for superior quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material provides durability and protection for the internal components of the bus driver and transceiver, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 0.08 ns

The low propagation delay at nominal supply allows for fast signal transmission, making this product suitable for high-speed communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V nominal supply voltage provides compatibility with standard electronic systems and power sources, making integration easier.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this bus driver and transceiver can withstand high heat environments, increasing its versatility in various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers JM38510/65604BRA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.2 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

.08 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Trade Compliance

JM38510/65604BRA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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