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JM38510/32301BCA

Texas Instruments

JM38510/32301BCA by Texas Instruments

JM38510/32301BCA by Texas Instruments is a MILITARY-grade Bus Driver & Transceiver with 4 functions, 18 ns propagation delay at 5V. It has TRUE output polarity, 3-STATE output characteristics, and operates in the temperature range of -55 to 125 °C. Ideal for UNIDIRECTIONAL control applications requiring ENABLE LOW functionality.

Median Price

$14.326

Lifecycle Status

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1k+

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Rochester

USA . 122 parts In-Stock

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DigiKey

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Verical

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Avnet

USA . 19 parts In-Stock

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Freelance Electronics

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Nova Conductors

Japan . 56 parts In-Stock

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NAC Semi

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Digiode

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American Microsemiconductor Inc.

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Vyrian

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Resion

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DigiKey Marketplace

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Mil-Aero Solutions, Inc.

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ComSIT Distribution GmbH

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Quantum Digital Technology

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Legend Electronics Inc.

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Odintec Ltd.

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Manoshevitz Elec. Sales

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AZTECH Wire

Italy . 238 parts In-Stock

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Continental Prestige Electronics

USA . 6,689 parts In-Stock

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Component Stockers USA

USA . 1,902 parts In-Stock

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$7.990

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Semicontronic

India . 138 parts In-Stock

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Corphita

USA . 4,805 parts In-Stock

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Corohmni

South Africa . 1,029 parts In-Stock

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Parana Technologies

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

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ChromeModa Solutions

Germany . 770 parts In-Stock

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Argo Parts USA

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Netroflash

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Perfect Parts

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DigiPath Technology Company

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Overview

Elevate your electronic designs with the JM38510/32301BCA by Texas Instruments, a top-of-the-line bus driver & transceiver. Crafted from high-quality ceramic and glass-sealed materials, this versatile component boasts 4 functions and a MIL-M-38510 Class B screening level for unparalleled reliability. Whether you're working on aerospace, defense, or industrial projects, this product delivers a nominal supply voltage of 5V and a maximum operating temperature of 125°C. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the component is rugged and reliable for long-term use.

Propagation Delay At Nominal Supply: 18 ns

Fast propagation delay ensures quick response times, making it suitable for high-speed bus driver applications.

No. of Functions: 4

Having multiple functions in one component can help save space on the circuit board and simplify the overall design.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage makes it compatible with many systems and easy to integrate.

Output Characteristics: 3-STATE

3-state output allows for tristate operation, enabling the bus driver to disconnect from the bus when not in use, reducing power consumption and signal interference.

Technical Specifications

Bus Driver & Transceivers JM38510/32301BCA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/32301BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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