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JM38510/32201BEA

Texas Instruments

JM38510/32201BEA by Texas Instruments

JM38510/32201BEA by Texas Instruments is a 6-bit bus driver with 3-STATE output, operating at -55 to 125 °C. It has a max I (ol) of 24 Amp and propagation delay of 22 ns. Ideal for military applications due to MIL-M-38510 Class B screening level.

Median Price

$12.600

Lifecycle Status

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28

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Chip1Stop

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Rochester

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$12.600

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$11.270

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$10.610

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DigiKey

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Verical

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Avnet

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Freelance Electronics

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Digiode

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TEDSS.com

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Electronic Expediters

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Nova Conductors

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Mil-Aero Solutions, Inc.

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Odintec Ltd.

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North Shore Components

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Cyclops Electronics Ltd

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Component Sense

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MISTER SPROCKETS

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Sunrise Surplus Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

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QIE Inc.

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Inland Empire Components Inc.

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Ampacity Inc.

Singapore . 228 parts In-Stock

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Corphita

USA . 3,505 parts In-Stock

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Parana Technologies

USA . 1,016 parts In-Stock

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DigiPath Technology Company

USA . 1,718 parts In-Stock

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 1,360 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock the power of seamless communication with the JM38510/32201BEA Bus Driver & Transceivers by Texas Instruments. Crafted with precision and expertise, this product guarantees top-notch quality and reliability. Perfect for military-grade applications, this device ensures optimal performance even in extreme conditions. Experience lightning-fast data transmission with minimal delay, offering unmatched value and benefits to customers. Elevate your projects with the trusted brand of Texas Instruments and stay ahead in the game of technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and resistance to temperature changes, making the product reliable for long-term use.

Screening Level: MIL-M-38510 Class B

The Class B screening level ensures high reliability and quality standards, meeting military-grade requirements for critical applications.

No. of Bits: 6

With 6 bits, this product offers sufficient data transmission capacity for various bus communication needs in industrial settings.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard 5V supply voltage, ensuring compatibility with common power sources.

Propagation Delay (tpd): 22 ns

With a low propagation delay, this product facilitates fast data transmission, improving overall system performance.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions, making it suitable for applications in harsh environments or industries.

Output Characteristics: 3-STATE

The 3-STATE output allows the driver to control the bus line, improving signal integrity and minimizing interference.

Width: 7.62 mm

Compact width design saves space and allows for easy integration into electronic systems with limited board space.

Technology: TTL

Utilizes TTL technology for high-speed data transmission and compatibility with TTL logic devices, ensuring reliable communication.

Technical Specifications

Bus Driver & Transceivers JM38510/32201BEA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/32201BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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