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JM38510/32203BEA

Texas Instruments

JM38510/32203BEA by Texas Instruments

JM38510/32203BEA by Texas Instruments is a MILITARY-grade TTL bus driver with 2 functions, 4-bit output, and 22ns propagation delay. It operates b/w -55 to 125 °C and has a max supply voltage of 5.5V. Ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

$7.666

Lifecycle Status

Suppliers In-Stock

31

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1k+

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Arrow

USA . 11 parts In-Stock

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Chip1Stop

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Verical

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Digiode

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Freelance Electronics

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NAC Semi

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Nova Conductors

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American Microsemiconductor Inc.

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Vyrian

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Resion

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Dan-Mar Components

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Mil-Aero Solutions, Inc.

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EPE Components Inc.

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PC Components Company LLC

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Atlantic Semiconductor

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Microfarads

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Quantum Digital Technology

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Odi Ramu Company

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Prism Electronics

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QIE Inc.

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North Shore Components

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Sunrise Surplus Inc.

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$0.830

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Corphita

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Continental Prestige Electronics

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Netroflash

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AZTECH Wire

Italy . 563 parts In-Stock

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Andel Nordic

Denmark . 1,200 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

UK . 1,087 parts In-Stock

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Argo Parts USA

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Elevate your electronic designs with the JM38510/32203BEA by Texas Instruments, a top-tier Bus Driver & Transceiver component that guarantees reliability and performance. Manufactured by the industry leader, this product boasts quality ceramic and glass-sealed packaging, making it suitable for military-grade applications. With 3-STATE output characteristics and a wide operating temperature range, this component ensures seamless integration into your projects. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 2

Allows for multiple functions to be performed by the device, increasing its versatility and usefulness.

Screening Level: MIL-M-38510 Class B

Indicates that the product meets strict military screening standards, ensuring reliability and performance in demanding environments.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in various industrial and military applications.

Technology: TTL

Utilizes TTL technology, known for its high-speed performance and compatibility with a wide range of systems.

Technical Specifications

Bus Driver & Transceivers JM38510/32203BEA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/32203BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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