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HPA00763DCKR

Texas Instruments

HPA00763DCKR by Texas Instruments

Texas Instruments' HPA00763DCKR is a Power Management IC with 5 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.6V to 4V and adjustable threshold at +1.14V, suitable for industrial applications requiring power supply support circuits in compact spaces due to its small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,066 parts In-Stock

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Digiode

USA . 1,737 parts In-Stock

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1,737

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Distributors (Availability)

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Semicontronic

India . 1,187 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,187

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 638 parts In-Stock

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$0.500

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638

$0.500

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One Stop Electronics

USA . 667 parts In-Stock

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$4.500

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667

$4.500

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AZTECH Wire

Italy . 543 parts In-Stock

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$10.954

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543

$10.954

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Parana Technologies

USA . 1,473 parts In-Stock

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$17.855

100+ parts

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$18.033

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1,473

$17.855

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$18.033

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ChromeModa Solutions

Germany . 5,631 parts In-Stock

1+ parts

$20.062

100+ parts

$16.451

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5,631

$20.062

$16.451

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$20.062

100+ parts

$19.059

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$18.056

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1,952

$20.062

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$18.056

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Corphita

USA . 3,806 parts In-Stock

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Microchip USA

USA . 2,550 parts In-Stock

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2,550

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DigiPath Technology Company

USA . 2,093 parts In-Stock

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$18.088

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$18.088

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Corohmni

South Africa . 383 parts In-Stock

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Overview

Enhance your power management capabilities with the HPA00763DCKR by Texas Instruments. Manufactured with premium quality materials and advanced technology, this small outline, thin profile IC offers reliable performance in a wide range of industrial applications. With an adjustable threshold voltage, dual terminal position, and a maximum supply voltage of 4V, this power supply support circuit provides efficient and precise control over your power needs. Trust Texas Instruments to deliver top-of-the-line solutions for all your power management requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 2 V

Optimal supply voltage for efficient power management and reliable operation of the device.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures the product can function in various environmental conditions without overheating.

Width (mm): 1.25 mm

Compact width allows for a smaller footprint on the circuit board, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.6 V

Supports a wide range of supply voltages, providing flexibility in design and compatibility with different power sources.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with potentially harsh conditions, ensuring durability and long-term performance.

Terminal Pitch: 0.65 mm

Fine pitch terminals enable high-density mounting on the circuit board, allowing for more features in a limited space.

Adjustable Threshold: YES

Ability to adjust the threshold voltage provides customization options for different applications and power management requirements.

Technical Specifications

Power Management ICs HPA00763DCKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

4 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.14V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

HPA00763DCKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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