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DLPC7541ZDC

Texas Instruments

DLPC7541ZDC by Texas Instruments

DLPC7541ZDC by Texas Instruments is a consumer IC with 676 terminals in a grid array package. Operating temperature ranges from 0 to 70°C, making it suitable for commercial applications. The surface-mountable IC has a plastic/epoxy body and ball terminal form, ideal for various consumer circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,826 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,826

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Digiode

USA . 1,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,177

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 481 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

$1.777

10k+ parts

-

481

$0.792

-

$1.777

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DigiPath Technology Company

USA . 1,523 parts In-Stock

1+ parts

$0.872

100+ parts

-

1k+ parts

-

10k+ parts

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1,523

$0.872

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-

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ChromeModa Solutions

Germany . 3,920 parts In-Stock

1+ parts

$0.890

100+ parts

$0.730

1k+ parts

-

10k+ parts

-

3,920

$0.890

$0.730

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IDEA Electronic Components Group

UK . 47 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

$0.801

10k+ parts

-

47

$0.890

-

$0.801

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Northwest PG Solutions

USA . 1,701 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

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10k+ parts

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1,701

$2.530

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One Stop Electronics

USA . 1,561 parts In-Stock

1+ parts

$9.800

100+ parts

-

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10k+ parts

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1,561

$9.800

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-

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$16.009

100+ parts

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799

$16.009

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Corphita

USA . 2,067 parts In-Stock

1+ parts

-

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2,067

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Native Components

USA . 888 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.231

10k+ parts

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888

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$2.231

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Overview

Elevate your consumer electronic designs with the DLPC7541ZDC by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions that exceed expectations. This versatile IC is perfect for a wide range of applications in the consumer electronics industry, offering unmatched performance and efficiency. Trust in Texas Instruments to provide cutting-edge technology that adds value and enhances the functionality of your products. Choose the DLPC7541ZDC for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection to the IC, making it suitable for a variety of consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and costs during manufacturing.

Package Shape: SQUARE

Square package shape makes it easy to place and align the IC on a circuit board, optimizing space usage in the design.

No. of Terminals: 676

The high number of terminals allows for a greater connectivity options and functionality within the IC for complex consumer circuit needs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can operate efficiently in various consumer electronic devices without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the IC can function reliably even in low-temperature environments, enhancing its versatility.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this IC is suitable for standard commercial applications, ensuring compatibility with a wide range of consumer devices.

Terminal Form: BALL

The ball terminal form facilitates secure and reliable connections between the IC and the circuit board, reducing the risk of connection failures in consumer electronics.

Technical Specifications

Other Function Consumer ICs DLPC7541ZDC attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B676

No. of Functions:

1

No. of Terminals:

676

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DLPC7541ZDC General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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