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DLPC6421AZPC

Texas Instruments

DLPC6421AZPC by Texas Instruments

DLPC6421AZPC by Texas Instruments is a consumer IC with 516 terminals in a grid array package. Operating temperature ranges from 0 to 55°C, suitable for commercial applications. It has a min supply voltage of 1.045V and max seated height of 2.42mm, making it ideal for various electronic devices.

Median Price

$99.850

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$99.850

100+ parts

$88.900

1k+ parts

$79.730

10k+ parts

-

40

$99.850

$88.900

$79.730

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,030 parts In-Stock

1+ parts

$94.858

100+ parts

-

1k+ parts

-

10k+ parts

-

3,030

$94.858

-

-

-

Vyrian

USA . 5,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,525

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,529 parts In-Stock

1+ parts

$3.261

100+ parts

-

1k+ parts

$3.786

10k+ parts

-

1,529

$3.261

-

$3.786

-

DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$3.591

100+ parts

-

1k+ parts

-

10k+ parts

-

1,689

$3.591

-

-

-

ChromeModa Solutions

Germany . 2,421 parts In-Stock

1+ parts

$3.664

100+ parts

$3.004

1k+ parts

-

10k+ parts

-

2,421

$3.664

$3.004

-

-

IDEA Electronic Components Group

UK . 891 parts In-Stock

1+ parts

$3.664

100+ parts

-

1k+ parts

$3.298

10k+ parts

-

891

$3.664

-

$3.298

-

Corphita

USA . 2,426 parts In-Stock

1+ parts

$89.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,426

$89.865

-

-

-

Northwest PG Solutions

USA . 2,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,244

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Native Components

USA . 584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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584

-

-

-

-

Microchip USA

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Overview

Unleash the power of innovation with the DLPC6421AZPC by Texas Instruments. Crafted with precision and expertise, this cutting-edge consumer IC offers unparalleled quality and reliability. From entertainment systems to smart home devices, this versatile product is designed to elevate your projects to new heights. Experience seamless performance and unmatched efficiency, all packed in a compact square package. Choose Texas Instruments for superior technology solutions that deliver value and exceed expectations. Elevate your designs with the DLPC6421AZPC today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

The square shape of the package offers a compact design, ideal for space-constrained applications.

Maximum Operating Temperature: 55 °C

The high maximum operating temperature ensures that the IC can perform reliably even in harsh environmental conditions.

Minimum Supply Voltage (Vsup): 1.045 V

The low minimum supply voltage requirement enables efficient power consumption, making it suitable for energy-efficient devices.

Technical Specifications

Other Function Consumer ICs DLPC6421AZPC attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

No. of Functions:

1

No. of Terminals:

516

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.42 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

DLPC6421AZPC General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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