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DLPC3479CZEZ

Texas Instruments

DLPC3479CZEZ by Texas Instruments

DLPC3479CZEZ by Texas Instruments is a consumer IC with 201 terminals in a square grid array package. It operates b/w -30 to 85°C, with Vsup ranging from 1.045V to 1.155V. Its fine pitch and thin profile make it suitable for various consumer circuit applications.

Median Price

$45.762

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 53,509 parts In-Stock

1+ parts

$45.762

100+ parts

$40.678

1k+ parts

$29.910

10k+ parts

-

53,509

$45.762

$40.678

$29.910

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$42.550

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$42.550

-

-

-

Digiode

USA . 591 parts In-Stock

1+ parts

$43.474

100+ parts

-

1k+ parts

-

10k+ parts

-

591

$43.474

-

-

-

Vyrian

USA . 6,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,069

-

-

-

-

Sensible Micro Corp

USA . 1,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,167

-

-

-

-

Chip Stock

USA . 825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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825

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

$0.963

100+ parts

-

1k+ parts

$1.862

10k+ parts

-

1,542

$0.963

-

$1.862

-

DigiPath Technology Company

USA . 1,861 parts In-Stock

1+ parts

$1.060

100+ parts

$0.976

1k+ parts

-

10k+ parts

-

1,861

$1.060

$0.976

-

-

ChromeModa Solutions

Germany . 4,508 parts In-Stock

1+ parts

$1.082

100+ parts

$0.887

1k+ parts

-

10k+ parts

-

4,508

$1.082

$0.887

-

-

IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$1.082

100+ parts

-

1k+ parts

$0.974

10k+ parts

-

527

$1.082

-

$0.974

-

Ampacity Inc.

Singapore . 26,808 parts In-Stock

1+ parts

$38.900

100+ parts

-

1k+ parts

-

10k+ parts

-

26,808

$38.900

-

-

-

Corphita

USA . 716 parts In-Stock

1+ parts

$41.186

100+ parts

-

1k+ parts

-

10k+ parts

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716

$41.186

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$42.550

100+ parts

$41.699

1k+ parts

-

10k+ parts

-

1,000

$42.550

$41.699

-

-

Microchip USA

USA . 2,167 parts In-Stock

1+ parts

$100.750

100+ parts

$99.000

1k+ parts

$98.120

10k+ parts

$97.240

2,167

$100.750

$99.000

$98.120

$97.240

Lixinc

USA . 9,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,092

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,000

-

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Overview

Elevate your electronic devices with the DLPC3479CZEZ by Texas Instruments, a cutting-edge consumer circuit that delivers unmatched quality and performance. From its durable plastic/epoxy package body to its grid array design, this IC sets the standard for excellence in the industry. With a wide range of applications, this product offers customers unparalleled value and benefits, making it the perfect choice for those seeking reliability and innovation. Upgrade your technology today with the DLPC3479CZEZ and experience the difference a superior product can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices, reducing overall size and improving efficiency.

Package Shape: SQUARE

The square shape allows for more efficient use of space on circuit boards, maximizing the number of components that can be installed.

No. of Terminals: 201

Having a high number of terminals allows for more complex circuit connections and functionalities to be achieved within the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can function reliably in a variety of environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for use in colder environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring stable electrical connections over time.

Width: 13 mm

The compact width of the IC allows for space-saving installation on circuit boards, ideal for compact electronic devices.

Maximum Supply Voltage (Vsup): 1.155 V

The high maximum supply voltage allows for versatility in power supply options, accommodating various system requirements.

Technical Specifications

Other Function Consumer ICs DLPC3479CZEZ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

201

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Trade Compliance

DLPC3479CZEZ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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