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DLPC3470CZEZ

Texas Instruments

DLPC3470CZEZ by Texas Instruments

DLPC3470CZEZ by Texas Instruments is a consumer circuit IC with 201 terminals in a grid array package. It operates b/w -30 to 85°C, with a supply voltage range of 1.045V to 1.155V. This IC is suitable for applications requiring fine pitch and thin profile components.

Median Price

$58.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 40,703 parts In-Stock

1+ parts

$40.392

100+ parts

$35.904

1k+ parts

$26.400

10k+ parts

-

40,703

$40.392

$35.904

$26.400

-

DigiKey

USA . 88 parts In-Stock

1+ parts

$58.600

100+ parts

$45.769

1k+ parts

$42.669

10k+ parts

-

88

$58.600

$45.769

$42.669

-

Mouser Electronics

USA . 98 parts In-Stock

1+ parts

$58.660

100+ parts

$46.000

1k+ parts

$42.970

10k+ parts

-

98

$58.660

$46.000

$42.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,890 parts In-Stock

1+ parts

$35.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,890

$35.900

-

-

-

Vyrian

USA . 6,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,740

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 847 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

$0.198

847

$0.206

-

-

$0.198

Northwest PG Solutions

USA . 893 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

893

$0.227

-

-

$0.200

Parana Technologies

USA . 2,312 parts In-Stock

1+ parts

$1.419

100+ parts

-

1k+ parts

$2.117

10k+ parts

-

2,312

$1.419

-

$2.117

-

ChromeModa Solutions

Germany . 6,289 parts In-Stock

1+ parts

$1.594

100+ parts

$1.307

1k+ parts

-

10k+ parts

-

6,289

$1.594

$1.307

-

-

IDEA Electronic Components Group

UK . 1,496 parts In-Stock

1+ parts

$1.594

100+ parts

-

1k+ parts

$1.435

10k+ parts

-

1,496

$1.594

-

$1.435

-

Corphita

USA . 4,538 parts In-Stock

1+ parts

$34.011

100+ parts

-

1k+ parts

-

10k+ parts

-

4,538

$34.011

-

-

-

Microchip USA

USA . 1,743 parts In-Stock

1+ parts

$109.780

100+ parts

$107.870

1k+ parts

$106.920

10k+ parts

$105.960

1,743

$109.780

$107.870

$106.920

$105.960

QUARKTWIN TECHNOLOGY LTD

USA . 23,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,720

-

-

-

-

Lixinc

USA . 5,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,383

-

-

-

-

DigiPath Technology Company

USA . 1,511 parts In-Stock

1+ parts

-

100+ parts

$1.437

1k+ parts

-

10k+ parts

-

1,511

-

$1.437

-

-

Overview

Unlock the potential of your consumer electronics with the DLPC3470CZEZ by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers unmatched performance and reliability in the field of Other Function Consumer ICs. This versatile IC offers a wide range of applications, from enhancing display technologies to improving overall system functionality. With its innovative design and advanced features, the DLPC3470CZEZ provides customers with exceptional value, efficiency, and performance that will take their products to the next level. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable packaging for the IC, making it suitable for a wide range of consumer applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand temperature variations without compromising performance, ensuring reliability in different operating environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature makes this IC suitable for use in cold environments, providing versatility for various applications.

Terminal Form: BALL

The ball terminal form enables reliable connections and efficient heat dissipation, enhancing the overall performance and longevity of the IC.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC has a moderate level of moisture sensitivity, allowing for a reasonable shelf life and ease of handling during storage and assembly.

Technical Specifications

Other Function Consumer ICs DLPC3470CZEZ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

201

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Trade Compliance

DLPC3470CZEZ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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