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DLP650LEFYL

Texas Instruments

DLP650LEFYL by Texas Instruments

DLP650LEFYL by Texas Instruments is a rectangular GRID ARRAY IC with 149 terminals. It operates b/w 0-90°C, with Vsup ranging from 3-3.6V. This consumer circuit IC is ideal for applications requiring precise image projection in compact devices.

Median Price

$125.048

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 259 parts In-Stock

1+ parts

$125.048

100+ parts

$113.190

1k+ parts

$107.800

10k+ parts

-

259

$125.048

$113.190

$107.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 186 parts In-Stock

1+ parts

$118.796

100+ parts

-

1k+ parts

-

10k+ parts

-

186

$118.796

-

-

-

Vyrian

USA . 4,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,646

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 124 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

10k+ parts

$0.144

124

$0.150

-

-

$0.144

Northwest PG Solutions

USA . 2,005 parts In-Stock

1+ parts

$0.165

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

2,005

$0.165

-

-

$0.146

Parana Technologies

USA . 2,190 parts In-Stock

1+ parts

$1.304

100+ parts

-

1k+ parts

$2.053

10k+ parts

-

2,190

$1.304

-

$2.053

-

DigiPath Technology Company

USA . 1,388 parts In-Stock

1+ parts

$1.436

100+ parts

-

1k+ parts

-

10k+ parts

-

1,388

$1.436

-

-

-

ChromeModa Solutions

Germany . 988 parts In-Stock

1+ parts

$1.465

100+ parts

$1.201

1k+ parts

-

10k+ parts

-

988

$1.465

$1.201

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-

IDEA Electronic Components Group

UK . 441 parts In-Stock

1+ parts

$1.465

100+ parts

-

1k+ parts

$1.318

10k+ parts

-

441

$1.465

-

$1.318

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Corphita

USA . 689 parts In-Stock

1+ parts

$112.543

100+ parts

-

1k+ parts

-

10k+ parts

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689

$112.543

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-

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Microchip USA

USA . 1,594 parts In-Stock

1+ parts

$152.050

100+ parts

$147.990

1k+ parts

$145.970

10k+ parts

$143.940

1,594

$152.050

$147.990

$145.970

$143.940

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

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Overview

Experience the cutting-edge technology of the DLP650LEFYL by Texas Instruments, a top-of-the-line consumer IC that promises unparalleled performance and reliability. Crafted with precision and expertise by Texas Instruments, this product boasts a package body material of ceramic and metal-sealed cofired, ensuring durability and longevity. With its versatile applications in various consumer circuits, this IC is a game-changer in the industry. Elevate your projects with the value and benefits that only Texas Instruments can deliver, and step into the future of innovation with the DLP650LEFYL.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides excellent durability and resistance to high temperatures, making it ideal for consumer electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuit boards, saving time and space during manufacturing.

No. of Terminals: 149

The large number of terminals allows for complex circuit connections and functionalities, making this IC suitable for versatile consumer applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions, ensuring reliable performance in various applications.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement allows for potential energy savings and efficiency in power consumption for connected devices.

Technical Specifications

Other Function Consumer ICs DLP650LEFYL attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-B149

JESD-609 Code:

e4

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

5.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

22.3 mm

Trade Compliance

DLP650LEFYL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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