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DLP6500BFLQ

Texas Instruments

DLP6500BFLQ by Texas Instruments

DLP6500BFLQ by Texas Instruments is a rectangular consumer IC with 203 terminals in a grid array package. It operates b/w 0-65°C, with supply voltage ranging from 3-3.6V. Ideal for applications requiring high-resolution imaging and display technologies.

Median Price

$1,318.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 82 parts In-Stock

1+ parts

$1,318.690

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$1,318.690

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,677 parts In-Stock

1+ parts

$1,252.756

100+ parts

-

1k+ parts

-

10k+ parts

-

1,677

$1,252.756

-

-

-

Vyrian

USA . 7,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,273

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,899 parts In-Stock

1+ parts

$1.000

100+ parts

$778.200

1k+ parts

$757.720

10k+ parts

$737.240

1,899

$1.000

$778.200

$757.720

$737.240

Parana Technologies

USA . 359 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

$3.853

10k+ parts

-

359

$3.330

-

$3.853

-

DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$3.667

100+ parts

$3.374

1k+ parts

-

10k+ parts

-

1,640

$3.667

$3.374

-

-

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$3.742

100+ parts

-

1k+ parts

$3.368

10k+ parts

-

2,034

$3.742

-

$3.368

-

ChromeModa Solutions

Germany . 1,160 parts In-Stock

1+ parts

$3.742

100+ parts

$3.068

1k+ parts

-

10k+ parts

-

1,160

$3.742

$3.068

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-

AZTECH Wire

Italy . 942 parts In-Stock

1+ parts

$16.330

100+ parts

-

1k+ parts

-

10k+ parts

-

942

$16.330

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-

-

Native Components

USA . 379 parts In-Stock

1+ parts

$43.380

100+ parts

-

1k+ parts

-

10k+ parts

$41.645

379

$43.380

-

-

$41.645

Northwest PG Solutions

USA . 2,317 parts In-Stock

1+ parts

$47.718

100+ parts

-

1k+ parts

-

10k+ parts

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2,317

$47.718

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-

-

Corphita

USA . 3,867 parts In-Stock

1+ parts

$1,186.821

100+ parts

-

1k+ parts

-

10k+ parts

-

3,867

$1,186.821

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-

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Overview

Experience unparalleled quality and innovation with the Texas Instruments DLP6500BFLQ. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that sets new standards in consumer ICs. This versatile product offers endless possibilities in various applications, providing customers with enhanced performance and reliability. With its advanced features and superior design, the DLP6500BFLQ guarantees exceptional value and benefits that will exceed your expectations. Trust Texas Instruments to bring you the best in technology for all your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product a good choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, making this product suitable for streamlined manufacturing processes.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65°C, this product can withstand high temperatures, ensuring stable performance in various environmental conditions.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V enables compatibility with a wide range of power sources, making this product versatile and adaptable.

Technical Specifications

Other Function Consumer ICs DLP6500BFLQ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

R-CBGA-B203

JESD-609 Code:

e4

Length:

40.64 mm

No. of Functions:

1

No. of Terminals:

203

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

6.604 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

BOTTOM

Width:

31.75 mm

Trade Compliance

DLP6500BFLQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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