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DLP6500BFYE

Texas Instruments

DLP6500BFYE by Texas Instruments

DLP6500BFYE by Texas Instruments is a rectangular consumer IC with 350 terminals. It operates b/w 0-90°C, with supply voltage ranging from 3.15V to 3.45V. This ceramic-metal sealed co-fired package is ideal for applications requiring high-resolution imaging and projection technology.

Median Price

$883.590

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$815.150

100+ parts

-

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-

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25

$815.150

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Texas Instruments

USA . 8 parts In-Stock

1+ parts

$859.421

100+ parts

$682.080

1k+ parts

-

10k+ parts

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8

$859.421

$682.080

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-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$907.760

100+ parts

-

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4

$907.760

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-

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DigiKey

USA . 1 parts In-Stock

1+ parts

$907.760

100+ parts

-

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1

$907.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,100 parts In-Stock

1+ parts

$774.392

100+ parts

-

1k+ parts

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1,100

$774.392

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Vyrian

USA . 6,956 parts In-Stock

1+ parts

-

100+ parts

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6,956

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 16 parts In-Stock

1+ parts

$1.774

100+ parts

-

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16

$1.774

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Northwest PG Solutions

USA . 1,545 parts In-Stock

1+ parts

$1.951

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-

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1,545

$1.951

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Parana Technologies

USA . 120 parts In-Stock

1+ parts

$3.267

100+ parts

-

1k+ parts

$3.792

10k+ parts

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120

$3.267

-

$3.792

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

$3.598

100+ parts

$3.310

1k+ parts

-

10k+ parts

-

1,135

$3.598

$3.310

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ChromeModa Solutions

Germany . 2,062 parts In-Stock

1+ parts

$3.671

100+ parts

$3.010

1k+ parts

-

10k+ parts

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2,062

$3.671

$3.010

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IDEA Electronic Components Group

UK . 918 parts In-Stock

1+ parts

$3.671

100+ parts

-

1k+ parts

$3.304

10k+ parts

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918

$3.671

-

$3.304

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Microchip USA

USA . 1,092 parts In-Stock

1+ parts

$625.630

100+ parts

$602.880

1k+ parts

$591.510

10k+ parts

$580.130

1,092

$625.630

$602.880

$591.510

$580.130

Corphita

USA . 190 parts In-Stock

1+ parts

$733.635

100+ parts

-

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190

$733.635

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

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Overview

Discover the cutting-edge technology behind the Texas Instruments DLP6500BFYE, a top-of-the-line consumer IC that offers unmatched quality and performance. With its ceramic, metal-sealed cofired package body material and 350 terminals in a rectangular shape, this product is designed to exceed expectations. Whether used in projectors, 3D printing, or automotive systems, the DLP6500BFYE delivers exceptional results. Elevate your projects with Texas Instruments' innovative solutions and experience the superior value and benefits this product has to offer.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired body material provides excellent durability and reliability, making this product suitable for long-term use in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and mounting on circuit boards, saving space and contributing to a more compact design.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, this product can withstand heat and operate efficiently in challenging environments.

Minimum Supply Voltage (Vsup): 3.15 V

The low minimum supply voltage requirement of 3.15V allows for flexible power options and compatibility with various power sources.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish contributes to good conductivity, corrosion resistance, and longevity, ensuring optimal performance over an extended period.

Technical Specifications

Other Function Consumer ICs DLP6500BFYE attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

R-CPGA-P350

JESD-609 Code:

e4

Length:

35 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

350

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Maximum Seated Height:

4.173 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Surface Mount:

NO

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

32.2 mm

Trade Compliance

DLP6500BFYE General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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