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DLP6500FLQ

Texas Instruments

DLP6500FLQ by Texas Instruments

DLP6500FLQ by Texas Instruments is a rectangular consumer IC with 203 terminals in a grid array package. It operates at a supply voltage range of 3-3.6V, with dimensions of 31.75mm width, 40.64mm length, and seated height of 6.604mm. Ideal for various consumer circuit applications requiring precise optical control and high-performance image projection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,458 parts In-Stock

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7,458

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Digiode

USA . 2,228 parts In-Stock

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2,228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 903 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

$3.133

10k+ parts

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903

$2.643

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$3.133

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DigiPath Technology Company

USA . 1,558 parts In-Stock

1+ parts

$2.911

100+ parts

$2.678

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1,558

$2.911

$2.678

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ChromeModa Solutions

Germany . 2,559 parts In-Stock

1+ parts

$2.970

100+ parts

$2.435

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2,559

$2.970

$2.435

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IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$2.970

100+ parts

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$2.673

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2,261

$2.970

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$2.673

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$6.674

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661

$6.674

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One Stop Electronics

USA . 642 parts In-Stock

1+ parts

$12.800

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642

$12.800

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Corphita

USA . 2,776 parts In-Stock

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2,776

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Northwest PG Solutions

USA . 1,634 parts In-Stock

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1,634

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Native Components

USA . 978 parts In-Stock

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978

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Microchip USA

USA . 363 parts In-Stock

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363

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Overview

Unlock a world of endless possibilities with the Texas Instruments DLP6500FLQ. Crafted with precision and quality, this cutting-edge consumer IC offers unparalleled performance and reliability. From entertainment to industrial applications, this versatile device is designed to exceed expectations. Experience seamless integration, exceptional value, and unmatched benefits with the DLP6500FLQ. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures excellent durability and resistance to extreme temperatures, making this product a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of this IC, saving time and effort during assembly processes.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is designed specifically for consumer electronics, offering optimized performance and functionality in such applications.

No. of Terminals: 203

With a high number of terminals, this IC provides ample connectivity options and flexibility in circuit design, catering to a wide range of requirements.

Maximum Seated Height: 6.604 mm

The low maximum seated height of 6.604 mm allows for compact and space-efficient designs when integrating this IC into electronic devices.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3 V makes this IC suitable for energy-efficient applications, helping to conserve power and reduce operating costs.

Technical Specifications

Other Function Consumer ICs DLP6500FLQ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

R-CBGA-B203

JESD-609 Code:

e4

Length:

40.64 mm

No. of Functions:

1

No. of Terminals:

203

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

6.604 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

BOTTOM

Width:

31.75 mm

Trade Compliance

DLP6500FLQ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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