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DLP6500FYE

Texas Instruments

DLP6500FYE by Texas Instruments

Texas Instruments DLP6500FYE is a rectangular consumer IC with 350 terminals in a grid array package. It operates at 3.15-3.45V, with dimensions of 32.2mm width and 35mm length, suitable for various consumer circuit applications like display technology and imaging systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,018 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,018

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Digiode

USA . 4,553 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,553

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 600 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

10k+ parts

$0.144

600

$0.150

-

-

$0.144

Northwest PG Solutions

USA . 246 parts In-Stock

1+ parts

$0.165

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

246

$0.165

-

-

$0.146

Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

$1.294

100+ parts

-

1k+ parts

$2.048

10k+ parts

-

1,088

$1.294

-

$2.048

-

ChromeModa Solutions

Germany . 5,985 parts In-Stock

1+ parts

$1.454

100+ parts

$1.192

1k+ parts

-

10k+ parts

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5,985

$1.454

$1.192

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$1.454

100+ parts

-

1k+ parts

$1.309

10k+ parts

-

777

$1.454

-

$1.309

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$14.338

100+ parts

-

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10k+ parts

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614

$14.338

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One Stop Electronics

USA . 341 parts In-Stock

1+ parts

$16.800

100+ parts

-

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341

$16.800

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Corphita

USA . 2,754 parts In-Stock

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2,754

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DigiPath Technology Company

USA . 2,322 parts In-Stock

1+ parts

-

100+ parts

$1.311

1k+ parts

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10k+ parts

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2,322

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$1.311

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Microchip USA

USA . 365 parts In-Stock

1+ parts

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100+ parts

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365

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Overview

Unlock a world of endless possibilities with the Texas Instruments DLP6500FYE, a cutting-edge consumer IC that promises top-notch quality and performance. Manufactured by industry leader Texas Instruments, this innovative product boasts a ceramic, metal-sealed cofired package body material and a rectangular package shape, setting it apart from the competition. With 350 terminals and a sleek grid array, shrink pitch package style, the DLP6500FYE delivers unparalleled value and benefits to customers across various applications. Embrace the future of technology with this advanced IC, designed to revolutionize your consumer electronics experience.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides durability and reliability to the product, making it suitable for long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and installation in various electronic devices, saving space and optimizing design layouts.

No. of Terminals: 350

With a high number of terminals, this product offers flexibility and versatility in connecting to different components and interfaces within a circuit.

Maximum Seated Height: 4.173 mm

The low maximum seated height enables a compact and slim design, making it ideal for applications where space is limited.

Minimum Supply Voltage (Vsup): 3.15 V

The low minimum supply voltage requirement allows for efficient power consumption, making the product energy-efficient and cost-effective.

Technical Specifications

Other Function Consumer ICs DLP6500FYE attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

SEATED HGT-CALCULATED

General IC Type:

JESD-30 Code:

R-CPGA-P350

Length:

35 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

350

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Maximum Seated Height:

4.173 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

32.2 mm

Trade Compliance

DLP6500FYE General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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