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DLP660TEFYG

Texas Instruments

DLP660TEFYG by Texas Instruments

DLP660TEFYG by Texas Instruments is a rectangular consumer IC with 350 terminals. It operates b/w 0-90°C, with supply voltage ranging from 1.65V to 1.95V. This IC is ideal for applications requiring high precision and reliability in consumer electronics.

Median Price

$453.210

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 80 parts In-Stock

1+ parts

$453.210

100+ parts

$444.190

1k+ parts

$435.130

10k+ parts

-

80

$453.210

$444.190

$435.130

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,348

-

-

-

-

Digiode

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,920 parts In-Stock

1+ parts

$1.157

100+ parts

-

1k+ parts

$1.970

10k+ parts

-

1,920

$1.157

-

$1.970

-

DigiPath Technology Company

USA . 1,823 parts In-Stock

1+ parts

$1.274

100+ parts

$1.172

1k+ parts

-

10k+ parts

-

1,823

$1.274

$1.172

-

-

ChromeModa Solutions

Germany . 3,402 parts In-Stock

1+ parts

$1.300

100+ parts

$1.066

1k+ parts

-

10k+ parts

-

3,402

$1.300

$1.066

-

-

IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$1.300

100+ parts

-

1k+ parts

$1.170

10k+ parts

-

2,267

$1.300

-

$1.170

-

AZTECH Wire

Italy . 426 parts In-Stock

1+ parts

$9.308

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$9.308

-

-

-

One Stop Electronics

USA . 1,204 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,204

$11.800

-

-

-

Native Components

USA . 607 parts In-Stock

1+ parts

$151.310

100+ parts

-

1k+ parts

-

10k+ parts

$145.258

607

$151.310

-

-

$145.258

Northwest PG Solutions

USA . 2,363 parts In-Stock

1+ parts

$166.441

100+ parts

-

1k+ parts

-

10k+ parts

-

2,363

$166.441

-

-

-

Corphita

USA . 1,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,834

-

-

-

-

Microchip USA

USA . 144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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144

-

-

-

-

Overview

Elevate your consumer electronics with the DLP660TEFYG by Texas Instruments, a high-quality IC designed to enhance performance and functionality. With a reputation for excellence in manufacturing, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this versatile IC offers unparalleled value and benefits to customers seeking top-tier solutions. Experience the advantages of superior quality and innovation with the DLP660TEFYG from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and durability, making the product reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing systems.

No. of Terminals: 350

Having a large number of terminals enables the product to support complex functions and connections.

Maximum Operating Temperature: 90 °C

Capable of operating at high temperatures, ensuring stable performance in various environments.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, suitable for applications in cold environments.

Width: 32 mm

Compact width allows for easy integration into tight spaces and smaller devices.

Length: 35 mm

Moderate length offers a balance between functionality and space-saving design.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage enables energy-efficient operation and compatibility with various power sources.

Maximum Supply Voltage (Vsup): 1.95 V

Having a maximum supply voltage within a specific range ensures the product's stability and prevents damage from excessive voltage.

Technical Specifications

Other Function Consumer ICs DLP660TEFYG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P350

Length:

35 mm

No. of Functions:

1

No. of Terminals:

350

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Maximum Seated Height:

5.083 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Trade Compliance

DLP660TEFYG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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