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DLP670SFYR

Texas Instruments

DLP670SFYR by Texas Instruments

DLP670SFYR by Texas Instruments is a consumer IC with 350 terminals in a rectangular grid array package. Operating temperature range is 0-70°C, with supply voltage ranging from 1.65V to 1.95V. Ideal for commercial applications requiring high terminal count and compact size.

Median Price

$932.501

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 30 parts In-Stock

1+ parts

$932.501

100+ parts

$844.074

1k+ parts

$803.880

10k+ parts

-

30

$932.501

$844.074

$803.880

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,838 parts In-Stock

1+ parts

$885.876

100+ parts

-

1k+ parts

-

10k+ parts

-

3,838

$885.876

-

-

-

Vyrian

USA . 4,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,139

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 770 parts In-Stock

1+ parts

$1.505

100+ parts

-

1k+ parts

$2.172

10k+ parts

-

770

$1.505

-

$2.172

-

DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$1.657

100+ parts

$1.525

1k+ parts

-

10k+ parts

-

1,640

$1.657

$1.525

-

-

ChromeModa Solutions

Germany . 3,380 parts In-Stock

1+ parts

$1.691

100+ parts

$1.387

1k+ parts

-

10k+ parts

-

3,380

$1.691

$1.387

-

-

IDEA Electronic Components Group

UK . 2,299 parts In-Stock

1+ parts

$1.691

100+ parts

-

1k+ parts

$1.522

10k+ parts

-

2,299

$1.691

-

$1.522

-

Native Components

USA . 98 parts In-Stock

1+ parts

$1.699

100+ parts

-

1k+ parts

-

10k+ parts

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98

$1.699

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-

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Northwest PG Solutions

USA . 418 parts In-Stock

1+ parts

$1.869

100+ parts

-

1k+ parts

-

10k+ parts

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418

$1.869

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-

-

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$18.440

100+ parts

-

1k+ parts

-

10k+ parts

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954

$18.440

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-

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Microchip USA

USA . 1,713 parts In-Stock

1+ parts

$547.410

100+ parts

$520.040

1k+ parts

$522.180

10k+ parts

$508.070

1,713

$547.410

$520.040

$522.180

$508.070

Corphita

USA . 1,110 parts In-Stock

1+ parts

$839.251

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

$839.251

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-

-

Overview

Elevate your consumer electronics with the DLP670SFYR by Texas Instruments. Crafted with precision and quality in mind, this advanced consumer circuit offers unparalleled performance and reliability. From cutting-edge technology to innovative design, Texas Instruments sets the gold standard in the industry. The versatile applications of this product range from home entertainment systems to medical devices, providing endless possibilities for creativity and functionality. Elevate your projects with the DLP670SFYR and experience the superior value, benefits, and advantages it brings to your products.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material provides excellent thermal and mechanical stability, making the product durable and reliable.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy integration into different electronic systems.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit type IC, this product is designed for consumer electronic applications, ensuring it meets the requirements of everyday use.

No. of Terminals: 350

The high number of terminals allows for versatile connectivity options, making the product suitable for complex circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, enhancing its performance in various operating conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in both hot and cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the product's longevity.

Width: 32.2 mm

The compact width of 32.2 mm allows for efficient use of space on the circuit board, making the product suitable for compact electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65 V makes the product energy-efficient and suitable for battery-operated devices.

Length: 35 mm

The length of 35 mm provides a balanced form factor, allowing for easy integration into different electronic systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets standard operating temperature requirements for commercial electronic applications.

Terminal Form: PIN/PEG

The pin/peg terminal form allows for easy and secure installation of the product on the circuit board, ensuring reliable connections and ease of assembly.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides sufficient spacing between terminals for efficient routing of connections, enhancing the product's overall performance.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage of 1.95 V ensures safe operation within the specified voltage range, protecting the product from potential damage due to overvoltage.

Technical Specifications

Other Function Consumer ICs DLP670SFYR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P350

JESD-609 Code:

e4

Length:

35 mm

No. of Functions:

1

No. of Terminals:

350

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA350,23X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

32.2 mm

Trade Compliance

DLP670SFYR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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