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DLP650TEA0FYP

Texas Instruments

DLP650TEA0FYP by Texas Instruments

DLP650TEA0FYP by Texas Instruments is a CONSUMER CIRCUIT IC with 149 terminals, operating b/w 0-70°C. It has a supply voltage range of 1.71-1.95V and features NICKEL GOLD terminal finish. This rectangular package is ideal for consumer electronics applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,942 parts In-Stock

1+ parts

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8,942

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Digiode

USA . 4,545 parts In-Stock

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4,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 894 parts In-Stock

1+ parts

$0.189

100+ parts

-

1k+ parts

-

10k+ parts

$0.181

894

$0.189

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-

$0.181

Northwest PG Solutions

USA . 1,213 parts In-Stock

1+ parts

$0.208

100+ parts

-

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$0.183

1,213

$0.208

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-

$0.183

Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

$2.794

100+ parts

-

1k+ parts

$3.279

10k+ parts

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1,607

$2.794

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$3.279

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DigiPath Technology Company

USA . 1,422 parts In-Stock

1+ parts

$3.076

100+ parts

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1,422

$3.076

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ChromeModa Solutions

Germany . 6,440 parts In-Stock

1+ parts

$3.139

100+ parts

$2.574

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6,440

$3.139

$2.574

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IDEA Electronic Components Group

UK . 2,314 parts In-Stock

1+ parts

$3.139

100+ parts

-

1k+ parts

$2.825

10k+ parts

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2,314

$3.139

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$2.825

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AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$6.188

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302

$6.188

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One Stop Electronics

USA . 1,362 parts In-Stock

1+ parts

$11.800

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1,362

$11.800

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Microchip USA

USA . 1,067 parts In-Stock

1+ parts

$292.370

100+ parts

$284.570

1k+ parts

$280.680

10k+ parts

$276.780

1,067

$292.370

$284.570

$280.680

$276.780

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,678 parts In-Stock

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4,678

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Corphita

USA . 4,058 parts In-Stock

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4,058

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Overview

Discover the innovative DLP650TEA0FYP by Texas Instruments, a high-quality consumer IC perfect for a wide range of applications. With a package body material of ceramic and metal-sealed cofired, this rectangular-shaped IC boasts 149 terminals with nickel gold terminal finish. Texas Instruments is renowned for its cutting-edge technology and the DLP650TEA0FYP is no exception. Experience the value and benefits that this product offers, from its commercial temperature grade to its low operating voltage. Upgrade your electronic projects with the DLP650TEA0FYP and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides a high level of durability and resistance to external elements, making this product ideal for consumer applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient integration into existing consumer circuit designs, optimizing space utilization and ease of assembly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate under normal consumer usage conditions without overheating.

Minimum Supply Voltage (Vsup): 1.71 V

The low minimum supply voltage requirement of 1.71V ensures compatibility with a wide range of consumer electronics, providing flexibility in application.

Temperature Grade: COMMERCIAL

The commercial temperature grade rating indicates that this product is suitable for use in standard consumer environments, offering reliable performance in everyday situations.

Technical Specifications

Other Function Consumer ICs DLP650TEA0FYP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P149

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

PERPENDICULAR

Trade Compliance

DLP650TEA0FYP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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