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CSD19531KCS

Texas Instruments

CSD19531KCS by Texas Instruments

CSD19531KCS by Texas Instruments is a N-CHANNEL power FET with a min DS breakdown voltage of 100V. It is designed for switching applications and has a max pulsed drain current of 285A.

Median Price

$1.396

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70,193 parts In-Stock

1+ parts

$0.840

100+ parts

$0.820

1k+ parts

$0.810

10k+ parts

-

70,193

$0.840

$0.820

$0.810

-

Texas Instruments

USA . 37,575 parts In-Stock

1+ parts

$1.396

100+ parts

$1.153

1k+ parts

$0.623

10k+ parts

-

37,575

$1.396

$1.153

$0.623

-

DigiKey

USA . 83 parts In-Stock

1+ parts

$2.130

100+ parts

$1.406

1k+ parts

$1.009

10k+ parts

$0.892

83

$2.130

$1.406

$1.009

$0.892

Mouser Electronics

USA . 1,023 parts In-Stock

1+ parts

$2.670

100+ parts

$1.180

1k+ parts

$0.890

10k+ parts

-

1,023

$2.670

$1.180

$0.890

-

Arrow

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$0.980

1k+ parts

$0.802

10k+ parts

$0.746

450

-

$0.980

$0.802

$0.746

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.087

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.087

-

-

-

Digiode

USA . 4,072 parts In-Stock

1+ parts

$1.326

100+ parts

-

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-

10k+ parts

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4,072

$1.326

-

-

-

TME

Poland . 89 parts In-Stock

1+ parts

$2.560

100+ parts

$1.230

1k+ parts

-

10k+ parts

-

89

$2.560

$1.230

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-

Chip Stock

USA . 19,500 parts In-Stock

1+ parts

-

100+ parts

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19,500

-

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-

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Vyrian

USA . 3,792 parts In-Stock

1+ parts

-

100+ parts

-

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3,792

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,204 parts In-Stock

1+ parts

$0.830

100+ parts

-

1k+ parts

-

10k+ parts

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9,204

$0.830

-

-

-

Parana Technologies

USA . 818 parts In-Stock

1+ parts

$1.096

100+ parts

-

1k+ parts

$1.936

10k+ parts

-

818

$1.096

-

$1.936

-

DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$1.207

100+ parts

$1.111

1k+ parts

-

10k+ parts

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798

$1.207

$1.111

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IDEA Electronic Components Group

UK . 794 parts In-Stock

1+ parts

$1.232

100+ parts

-

1k+ parts

$1.109

10k+ parts

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794

$1.232

-

$1.109

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ChromeModa Solutions

Germany . 115 parts In-Stock

1+ parts

$1.232

100+ parts

$1.010

1k+ parts

-

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115

$1.232

$1.010

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Corphita

USA . 4,264 parts In-Stock

1+ parts

$1.256

100+ parts

-

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4,264

$1.256

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-

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Assy Fe

Spain . 17,500 parts In-Stock

1+ parts

-

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17,500

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A-Z Elektronik GmbH

Germany . 8,956 parts In-Stock

1+ parts

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8,956

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-

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Alle Elektronik GmbH

Germany . 3,566 parts In-Stock

1+ parts

-

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3,566

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Kepictronics

USA . 35 parts In-Stock

1+ parts

-

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35

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Overview

Experience the power of the CSD19531KCS by Texas Instruments, a high-quality Power Field Effect Transistor (FET) that offers unmatched performance and reliability. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its maximum pulsing drain current of 285A and avalanche energy rating of 180mJ ensure optimal operation even in demanding conditions. Whether you're in the automotive industry or industrial automation, the CSD19531KCS delivers exceptional value with its low on-resistance and high power dissipation capability. Trust Texas Instruments, a leading manufacturer renowned for producing cutting-edge electronic components. Discover the numerous benefits and advantages this product offers, and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for efficient power switching.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications effectively and safely.

Maximum Power Dissipation (Abs): 179 W

The high power dissipation rating of 179W allows for the FET to operate at high power levels without overheating, ensuring reliability.

Maximum Operating Temperature: 175 °C

The FET can withstand high temperatures up to 175 °C, making it suitable for use in environments where temperature fluctuations are common.

Technical Specifications

Power Field Effect Transistors (FET) CSD19531KCS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

17 pF

JEDEC-95 Code:

TO-220

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

285 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19531KCS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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