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CSD18510KTT

Texas Instruments

CSD18510KTT by Texas Instruments

CSD18510KTT by Texas Instruments is an N-CHANNEL Power FET for SWITCHING applications. It has a 40V DS Breakdown Voltage, 400A Max Pulsed Drain Current, and 0.0026 ohm Max Drain-Source Resistance. This SINGLE configuration FET operates in ENHANCEMENT MODE with a temperature range of -55 to 175 °C.

Median Price

$3.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 184,695 parts In-Stock

1+ parts

$1.579

100+ parts

$1.304

1k+ parts

$0.705

10k+ parts

-

184,695

$1.579

$1.304

$0.705

-

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$3.000

100+ parts

$1.390

1k+ parts

$1.000

10k+ parts

-

141

$3.000

$1.390

$1.000

-

DigiKey

USA . 116 parts In-Stock

1+ parts

$3.120

100+ parts

$1.404

1k+ parts

$0.966

10k+ parts

$0.875

116

$3.120

$1.404

$0.966

$0.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,387 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

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1,387

$1.500

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Vyrian

USA . 3,857 parts In-Stock

1+ parts

-

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-

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3,857

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 61,519 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

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61,519

$1.340

-

-

-

Semicontronic

India . 61,393 parts In-Stock

1+ parts

$1.340

100+ parts

$1.306

1k+ parts

$1.300

10k+ parts

-

61,393

$1.340

$1.306

$1.300

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Corphita

USA . 743 parts In-Stock

1+ parts

$1.421

100+ parts

-

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-

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743

$1.421

-

-

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Parana Technologies

USA . 171 parts In-Stock

1+ parts

$1.527

100+ parts

-

1k+ parts

$2.184

10k+ parts

-

171

$1.527

-

$2.184

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Corohmni

South Africa . 192 parts In-Stock

1+ parts

$1.579

100+ parts

-

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-

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192

$1.579

-

-

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DigiPath Technology Company

USA . 1,470 parts In-Stock

1+ parts

$1.682

100+ parts

$1.547

1k+ parts

-

10k+ parts

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1,470

$1.682

$1.547

-

-

IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$1.716

100+ parts

-

1k+ parts

$1.544

10k+ parts

-

1,962

$1.716

-

$1.544

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ChromeModa Solutions

Germany . 1,825 parts In-Stock

1+ parts

$1.716

100+ parts

$1.407

1k+ parts

-

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1,825

$1.716

$1.407

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Native Components

USA . 970 parts In-Stock

1+ parts

$10.238

100+ parts

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970

$10.238

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Northwest PG Solutions

USA . 265 parts In-Stock

1+ parts

$11.262

100+ parts

$10.135

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-

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265

$11.262

$10.135

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Lixinc

USA . 8,723 parts In-Stock

1+ parts

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8,723

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A-Z Elektronik GmbH

Germany . 777 parts In-Stock

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777

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Kepictronics

USA . 126 parts In-Stock

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126

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the CSD18510KTT Power Field Effect Transistor. This N-CHANNEL transistor is perfect for switching applications, offering enhanced performance and efficiency. With a high DS breakdown voltage and low on-resistance, this transistor delivers exceptional power handling capabilities. Whether you're designing automotive electronics, industrial control systems, or renewable energy solutions, the CSD18510KTT provides the value and benefits you need to take your projects to the next level. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the transistor, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower resistance and higher efficiency compared to P-channel FETs, making them a popular choice for switching applications.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into existing systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Pulsed Drain Current (IDM): 400 A

High IDM rating allows the transistor to handle large current spikes, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Maximum Drain-Source On Resistance: 0.0026 ohm

Low on-resistance results in minimal power losses and helps enhance overall efficiency of the circuit.

Technical Specifications

Power Field Effect Transistors (FET) CSD18510KTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

328 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

551 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18510KTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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