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CSD16340Q3T

Texas Instruments

CSD16340Q3T by Texas Instruments

CSD16340Q3T by Texas Instruments is an N-CHANNEL FET for SWITCHING applications. It features a Max Drain Current of 21A, Min DS Breakdown Voltage of 25V, and Max Pulsed Drain Current of 115A. With a package style of SMALL OUTLINE and operating temperatures ranging from -55 to 150°C, it's ideal for power management in various electronic devices.

Median Price

$0.784

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,807 parts In-Stock

1+ parts

$1.057

100+ parts

$0.813

1k+ parts

$0.428

10k+ parts

-

7,807

$1.057

$0.813

$0.428

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Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.510

10k+ parts

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250

-

-

$0.510

-

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.826

100+ parts

-

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50

$0.826

-

-

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Digiode

USA . 1,705 parts In-Stock

1+ parts

$1.004

100+ parts

-

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1,705

$1.004

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Chip Stock

USA . 99,400 parts In-Stock

1+ parts

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99,400

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Vyrian

USA . 9,118 parts In-Stock

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9,118

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,767 parts In-Stock

1+ parts

$0.433

100+ parts

-

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2,767

$0.433

-

-

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Parana Technologies

USA . 521 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

$1.690

10k+ parts

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521

$0.618

-

$1.690

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DigiPath Technology Company

USA . 873 parts In-Stock

1+ parts

$0.680

100+ parts

$0.626

1k+ parts

-

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873

$0.680

$0.626

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ChromeModa Solutions

Germany . 6,319 parts In-Stock

1+ parts

$0.694

100+ parts

$0.569

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-

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6,319

$0.694

$0.569

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IDEA Electronic Components Group

UK . 653 parts In-Stock

1+ parts

$0.694

100+ parts

-

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$0.625

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653

$0.694

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$0.625

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.809

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$0.777

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500

$0.809

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$0.777

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Continental Prestige Electronics

USA . 5,928 parts In-Stock

1+ parts

$0.826

100+ parts

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$0.809

5,928

$0.826

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$0.809

Argo Parts USA

USA . 1,511 parts In-Stock

1+ parts

$0.826

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1,511

$0.826

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Corphita

USA . 4,961 parts In-Stock

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$0.951

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4,961

$0.951

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Corohmni

South Africa . 1,227 parts In-Stock

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$1.635

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1,227

$1.635

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Kepictronics

USA . 33,320 parts In-Stock

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Perfect Parts

USA . 4,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Speed Components Ltd (Excess)

Israel . 11 parts In-Stock

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11

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor? Look no further than the CSD16340Q3T by Texas Instruments. With its N-CHANNEL configuration and ENHANCEMENT MODE operation, this transistor is perfect for SWITCHING applications. Texas Instruments is known for its top-notch products, and this one is no exception. The CSD16340Q3T offers customers value through its superior performance, ease of use, and durability. Whether you're working on automotive, industrial, or consumer electronics projects, this transistor will meet your needs and exceed your expectations. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the transistor, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors are commonly used in power electronics for efficient switching operations, making this product suitable for high-performance applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and enhances the reliability of the transistor by reducing potential failure points.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient operation in various electronic systems.

Surface Mount: YES

Being surface mountable, this FET is easy to integrate into PCB designs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this transistor can reliably handle high voltage levels, making it suitable for power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching characteristics, leading to improved efficiency and performance.

Maximum Pulsed Drain Current (IDM): 115 A

The high pulsed drain current rating of 115 A allows this FET to withstand short-term overloads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating of 80 mJ ensures the transistor can handle sudden voltage spikes without damage, increasing system reliability.

No. of Terminals: 8

With 8 terminals, this FET provides flexible connectivity options, enabling versatile use in different circuit configurations.

Maximum Drain Current (ID): 21 A

The high maximum drain current rating of 21 A allows this transistor to handle significant power loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0078 ohm

The low drain-source on resistance of 0.0078 ohm minimizes power losses and improves efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) CSD16340Q3T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.0078 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

69 pF

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

115 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD16340Q3T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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