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COP8SCR9HVA8/63SN

Texas Instruments

COP8SCR9HVA8/63SN by Texas Instruments

COP8SCR9HVA8/63SN by Texas Instruments is an 8-bit microcontroller with a max clock frequency of 10 MHz. It features 1024 bytes of RAM, SPI and USART connectivity, and operates in automotive-grade temperatures. Ideal for applications requiring low power consumption and fixed-point format processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,244 parts In-Stock

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Digiode

USA . 935 parts In-Stock

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935

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Distributors (Availability)

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Native Components

USA . 142 parts In-Stock

1+ parts

$5.340

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142

$5.340

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Parana Technologies

USA . 599 parts In-Stock

1+ parts

$13.712

100+ parts

$1,273.389

1k+ parts

$12.341

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599

$13.712

$1,273.389

$12.341

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

$15.099

100+ parts

$13.891

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1,647

$15.099

$13.891

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ChromeModa Solutions

Germany . 1,818 parts In-Stock

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$15.407

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$12.634

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1,818

$15.407

$12.634

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IDEA Electronic Components Group

UK . 1,135 parts In-Stock

1+ parts

$15.407

100+ parts

$14.637

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$13.866

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1,135

$15.407

$14.637

$13.866

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AZTECH Wire

Italy . 759 parts In-Stock

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$19.568

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759

$19.568

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One Stop Electronics

USA . 448 parts In-Stock

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$22.000

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448

$22.000

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Microchip USA

USA . 2,601 parts In-Stock

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$40.890

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$40.310

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$40.020

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$39.720

2,601

$40.890

$40.310

$40.020

$39.720

QUARKTWIN TECHNOLOGY LTD

USA . 18,794 parts In-Stock

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Corphita

USA . 3,018 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Northwest PG Solutions

USA . 1,671 parts In-Stock

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$5.233

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1,671

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$5.233

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Overview

Experience high-quality performance with the COP8SCR9HVA8/63SN microcontroller from Texas Instruments. This versatile chip carrier package offers a wide range of applications in automotive technology, ensuring reliable operation in extreme temperatures. With features like low power mode, PWM channels, and multiple connectivity options, this microcontroller provides exceptional value and efficiency for your projects. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your designs with the COP8SCR9HVA8/63SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 5.5 V

Allows for versatility in power supply options, accommodating a range of applications.

CPU Family: COP800

The COP800 CPU family offers efficient performance and reliable operation for various tasks.

ROM Words: 32768

Ample ROM capacity for storing program instructions, enabling complex functionalities to be implemented.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals on a single chip, reducing system complexity and cost.

Connectivity: SPI, USART(2)

Supports communication with other devices, expanding the capabilities and versatility of the product.

RAM Bytes: 1024

Sufficient RAM for data storage and processing, enhancing the microcontroller's ability to handle multiple tasks simultaneously.

Speed: 20 rpm

Capable of high-speed operation, suitable for time-sensitive applications or tasks requiring quick response times.

Technical Specifications

Microcontrollers COP8SCR9HVA8/63SN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

COP800

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

13

No. of I/O Lines:

37

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

20 rpm

Maximum Supply Current:

14.7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, USART(2)

Peripherals:

BOD, TIMER(4), WDT

Trade Compliance

COP8SCR9HVA8/63SN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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