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CDCFR83DBQRG4

Texas Instruments

CDCFR83DBQRG4 by Texas Instruments

Texas Instruments CDCFR83DBQRG4 is Clock Drivers & Buffers with 24 terminals, operating at -40 to 85 °C. It has a max frequency of 533 MHz and supports a supply voltage range of 3.135V to 3.465V. Ideal for industrial applications requiring high-speed clock signal distribution in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,589 parts In-Stock

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8,589

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Digiode

USA . 3,703 parts In-Stock

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3,703

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Distributors (Availability)

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Andel Nordic

Denmark . 1,425 parts In-Stock

1+ parts

$7.334

100+ parts

-

1k+ parts

$7.041

10k+ parts

$7.041

1,425

$7.334

-

$7.041

$7.041

AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$10.897

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720

$10.897

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Parana Technologies

USA . 1,718 parts In-Stock

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$24.309

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$24.970

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1,718

$24.309

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$24.970

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$26.768

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2,370

$26.768

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IDEA Electronic Components Group

UK . 1,795 parts In-Stock

1+ parts

$27.314

100+ parts

$25.948

1k+ parts

$24.583

10k+ parts

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1,795

$27.314

$25.948

$24.583

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ChromeModa Solutions

Germany . 1,429 parts In-Stock

1+ parts

$27.314

100+ parts

$22.397

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1,429

$27.314

$22.397

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One Stop Electronics

USA . 1,590 parts In-Stock

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$30.000

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1,590

$30.000

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Kepictronics

USA . 6,128 parts In-Stock

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Microchip USA

USA . 2,689 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,868 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,245 parts In-Stock

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Corphita

USA . 954 parts In-Stock

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Northwest PG Solutions

USA . 704 parts In-Stock

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Native Components

USA . 485 parts In-Stock

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485

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Overview

Enhance your electronic designs with the CDCFR83DBQRG4 clock driver and buffer from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a variety of applications in the clock drivers & buffers category. This small outline, shrink pitch package offers 3-STATE output characteristics and a wide operating temperature range, making it ideal for industrial use. With a maximum supply voltage of 3.465V and a maximum power supply current of 100mA, this versatile component provides value and performance to meet your design needs. Upgrade your projects today with the CDCFR83DBQRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the clock driver & buffer.

Surface Mount: YES

Allows for easy installation on PCBs and saves space compared to through-hole mounting.

Nominal Supply Voltage: 3.3V

Compatible with common supply voltages in electronic systems.

Maximum Operating Temperature: 85°C

Suitable for industrial environments where elevated temperatures may be present.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Clock Drivers & Buffers CDCFR83DBQRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

83

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

36 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

1

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

533 MHz

Trade Compliance

CDCFR83DBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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