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CDC351IDWRG4

Texas Instruments

CDC351IDWRG4 by Texas Instruments

CDC351IDWRG4 by Texas Instruments is a clock driver with 24 terminals and 3.3V nominal voltage. It features a propagation delay of 4.2ns, operates in industrial temperature range (-40 to 85°C), and has a max frequency of 100MHz. Ideal for applications requiring precise clock synchronization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,830 parts In-Stock

1+ parts

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7,830

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Digiode

USA . 688 parts In-Stock

1+ parts

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688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 618 parts In-Stock

1+ parts

$3.000

100+ parts

-

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618

$3.000

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Andel Nordic

Denmark . 3,750 parts In-Stock

1+ parts

$3.526

100+ parts

-

1k+ parts

$3.385

10k+ parts

$3.385

3,750

$3.526

-

$3.385

$3.385

AZTECH Wire

Italy . 298 parts In-Stock

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$7.631

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-

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298

$7.631

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Parana Technologies

USA . 669 parts In-Stock

1+ parts

$13.928

100+ parts

-

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$14.407

10k+ parts

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669

$13.928

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$14.407

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DigiPath Technology Company

USA . 1,929 parts In-Stock

1+ parts

$15.336

100+ parts

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1,929

$15.336

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ChromeModa Solutions

Germany . 1,297 parts In-Stock

1+ parts

$15.649

100+ parts

$12.832

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1,297

$15.649

$12.832

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IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$15.649

100+ parts

$14.867

1k+ parts

$14.084

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249

$15.649

$14.867

$14.084

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Component Stockers USA

USA . 495 parts In-Stock

1+ parts

$99.990

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495

$99.990

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Kepictronics

USA . 4,450 parts In-Stock

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4,450

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Northwest PG Solutions

USA . 2,315 parts In-Stock

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Corphita

USA . 1,123 parts In-Stock

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1,123

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Native Components

USA . 841 parts In-Stock

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841

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Microchip USA

USA . 310 parts In-Stock

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310

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Overview

Elevate your clock driver and buffer solutions with the CDC351IDWRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. Designed for precision and reliability, this clock driver offers fast propagation delay and versatile input conditioning. Ideal for a wide range of applications, this small outline package is perfect for industrial use. Experience seamless performance and efficient operation with the CDC351IDWRG4, providing unmatched value and benefits to customers seeking advanced clock drivers and buffers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for electronic devices that need to be portable and long-lasting.

Propagation Delay At Nominal Supply: 4.2 ns

With a low propagation delay, this clock driver & buffer ensures fast and efficient operation in timing critical applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard 3.3V supply voltage, making it compatible with a wide range of electronic systems.

Maximum I (ol): 32 Amp

Can drive high output currents of up to 32A, making it suitable for driving multiple loads without the need for additional amplification.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this clock driver & buffer is suitable for use in harsh environments or industrial applications.

Technology: BICMOS

Utilizes BICMOS technology, combining the advantages of both bipolar and CMOS technologies for improved performance and efficiency.

Technical Specifications

Clock Drivers & Buffers CDC351IDWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

4.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.9 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC351IDWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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