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CDC329ADG4

Texas Instruments

CDC329ADG4 by Texas Instruments

CDC329ADG4 clock driver by Texas Instruments features 16 terminals, 5V nominal voltage, and 5.9ns propagation delay. Ideal for industrial applications requiring a small outline package style and standard input conditioning. Operating temperature range from -40 to 85°C makes it suitable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,523 parts In-Stock

1+ parts

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3,523

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Digiode

USA . 2,981 parts In-Stock

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2,981

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Euro-Tech

UK . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,497 parts In-Stock

1+ parts

$5.201

100+ parts

-

1k+ parts

$4.993

10k+ parts

$4.993

3,497

$5.201

-

$4.993

$4.993

AZTECH Wire

Italy . 855 parts In-Stock

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$14.901

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-

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855

$14.901

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One Stop Electronics

USA . 1,231 parts In-Stock

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$20.000

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1,231

$20.000

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Parana Technologies

USA . 33 parts In-Stock

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$21.171

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$21.459

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33

$21.171

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$21.459

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DigiPath Technology Company

USA . 674 parts In-Stock

1+ parts

$23.312

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674

$23.312

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ChromeModa Solutions

Germany . 6,188 parts In-Stock

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$23.788

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$19.506

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6,188

$23.788

$19.506

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$23.788

100+ parts

$22.599

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$21.409

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1,155

$23.788

$22.599

$21.409

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Native Components

USA . 443 parts In-Stock

1+ parts

$777.930

100+ parts

$762.371

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$754.592

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$746.813

443

$777.930

$762.371

$754.592

$746.813

Northwest PG Solutions

USA . 546 parts In-Stock

1+ parts

$855.723

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546

$855.723

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Microchip USA

USA . 1,789 parts In-Stock

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Corphita

USA . 312 parts In-Stock

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Overview

Experience superior clock driver performance with the Texas Instruments CDC329ADG4. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. Clock Drivers & Buffers like the CDC329ADG4 are essential components for a wide range of applications, ensuring precise timing and synchronization. With a small outline package style and industrial temperature grade, this product offers unmatched value and benefits to customers seeking high-speed operation and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external damage, ensuring the product's longevity.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and enabling efficient assembly of electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and reliable operation of the clock drivers and buffers.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance of 85°C ensures the product's reliability in demanding industrial environments.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS technologies, providing high speed and low power consumption for efficient clock signal driving.

No. of True Outputs: 6

Having 6 true outputs allows for multiple clock signals to be distributed effectively, catering to complex electronic circuits or systems.

Minimum fmax: 80 MHz

High maximum frequency of 80 MHz ensures the clock drivers and buffers can support fast data processing and communication in electronic devices.

Technical Specifications

Clock Drivers & Buffers CDC329ADG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

329

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1.5 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

CDC329ADG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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