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CDC2351DWRG4

Texas Instruments

CDC2351DWRG4 by Texas Instruments

CDC2351DWRG4 clock driver by Texas Instruments features a 4.8 ns propagation delay at 3.3V, suitable for applications requiring precise timing control. With 24 terminals and a small outline package style, it offers 10 true outputs with a max frequency of 100 MHz. Ideal for commercial-grade temperature environments, this BICMOS technology device is designed for surface mount assembly with standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,983 parts In-Stock

1+ parts

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4,983

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Digiode

USA . 4,056 parts In-Stock

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4,056

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,940 parts In-Stock

1+ parts

$6.439

100+ parts

-

1k+ parts

$6.181

10k+ parts

$6.181

4,940

$6.439

-

$6.181

$6.181

Ampacity Inc.

Singapore . 1,180 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,180

$7.000

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AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$8.957

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801

$8.957

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One Stop Electronics

USA . 230 parts In-Stock

1+ parts

$12.000

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230

$12.000

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Parana Technologies

USA . 1,751 parts In-Stock

1+ parts

$20.894

100+ parts

$1,940.291

1k+ parts

$18.804

10k+ parts

-

1,751

$20.894

$1,940.291

$18.804

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DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$23.006

100+ parts

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549

$23.006

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ChromeModa Solutions

Germany . 5,474 parts In-Stock

1+ parts

$23.476

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$19.250

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5,474

$23.476

$19.250

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IDEA Electronic Components Group

UK . 1,313 parts In-Stock

1+ parts

$23.476

100+ parts

$22.302

1k+ parts

$21.128

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1,313

$23.476

$22.302

$21.128

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A-Z Elektronik GmbH

Germany . 6,837 parts In-Stock

1+ parts

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6,837

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Corphita

USA . 4,813 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,558 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 1,576 parts In-Stock

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1,576

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Northwest PG Solutions

USA . 1,109 parts In-Stock

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1,109

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Native Components

USA . 795 parts In-Stock

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795

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Overview

Elevate your electronic designs with the Texas Instruments CDC2351DWRG4 Clock Drivers & Buffers. Crafted with precision and expertise by a renowned manufacturer, this product offers unmatched quality and reliability. Ideal for a wide range of applications, this clock driver ensures smooth and efficient operation. With a fast propagation delay, low power consumption, and compact design, the CDC2351DWRG4 delivers exceptional value and performance to customers. Upgrade your projects today with this top-of-the-line component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Propagation Delay At Nominal Supply: 4.8 ns

Offers fast signal transmission for efficient performance.

Surface Mount: YES

Ease of installation on circuit boards for streamlined production.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages for versatile use.

Load Capacitance (CL): 50 pF

Optimized for handling standard load capacitances effectively.

Maximum I (ol): 12 Amp

Can drive higher current loads without overheating or damage.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Provides flexibility in controlling the output state of the device.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies for improved performance.

Technical Specifications

Clock Drivers & Buffers CDC2351DWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC2351DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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