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CDC209DWR

Texas Instruments

CDC209DWR by Texas Instruments

The Texas Instruments CDC209DWR clock driver has a propagation delay of 15.6 ns, operates at 3.3/5 V, and offers 4 true outputs. It is used in industrial applications requiring precise timing control and features a small outline package with gull wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,002 parts In-Stock

1+ parts

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6,002

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Digiode

USA . 4,881 parts In-Stock

1+ parts

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4,881

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 503 parts In-Stock

1+ parts

$0.667

100+ parts

-

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-

503

$0.667

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Northwest PG Solutions

USA . 802 parts In-Stock

1+ parts

$0.734

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-

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-

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802

$0.734

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Andel Nordic

Denmark . 2,477 parts In-Stock

1+ parts

$5.377

100+ parts

-

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$5.162

10k+ parts

$5.162

2,477

$5.377

-

$5.162

$5.162

Parana Technologies

USA . 873 parts In-Stock

1+ parts

$13.995

100+ parts

-

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$14.468

10k+ parts

-

873

$13.995

-

$14.468

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$14.469

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489

$14.469

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$15.410

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1,057

$15.410

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$15.725

100+ parts

$14.939

1k+ parts

$14.152

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-

786

$15.725

$14.939

$14.152

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ChromeModa Solutions

Germany . 396 parts In-Stock

1+ parts

$15.725

100+ parts

$12.894

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396

$15.725

$12.894

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One Stop Electronics

USA . 206 parts In-Stock

1+ parts

$48.000

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206

$48.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 2,388 parts In-Stock

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2,388

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Overview

Enhance your electronic projects with the Texas Instruments CDC209DWR clock driver and buffer. Crafted with precision and expertise by a trusted manufacturer, this device offers reliable performance and seamless integration. Ideal for a wide range of applications in the clock drivers & buffers category, this product boasts quick propagation delay and high output characteristics. Elevate your designs with the CDC209DWR's true outputs and enable low control type, providing value and efficiency to your projects. Experience the quality and benefits of Texas Instruments technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 15.6 ns

With fast propagation delay, this clock driver ensures efficient and timely signal transmission.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with a standard 5V supply voltage, making it suitable for a wide range of applications.

No. of Bits: 4

Suitable for handling 4-bit data, making it ideal for various digital systems and applications.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, ensuring reliable performance.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance state, providing flexibility in signal control and routing.

Technical Specifications

Clock Drivers & Buffers CDC209DWR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

209

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

Length:

12.825 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15.6 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.52 mm

Minimum fmax:

60 MHz

Trade Compliance

CDC209DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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