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CDC222PAH

Texas Instruments

CDC222PAH by Texas Instruments

Texas Instruments CDC222PAH is a clock driver with 1.1ns propagation delay, suitable for commercial applications. It operates at 3.3V, has 52 terminals in a square package, and can withstand temperatures from 0 to 70°C. Ideal for surface mount designs requiring precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,199 parts In-Stock

1+ parts

-

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4,199

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Digiode

USA . 3,049 parts In-Stock

1+ parts

-

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-

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3,049

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 892 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

892

$0.072

-

-

$0.069

Northwest PG Solutions

USA . 692 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

692

$0.079

-

-

$0.070

AZTECH Wire

Italy . 751 parts In-Stock

1+ parts

$5.493

100+ parts

-

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751

$5.493

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Andel Nordic

Denmark . 1,175 parts In-Stock

1+ parts

$6.711

100+ parts

-

1k+ parts

$6.442

10k+ parts

$6.442

1,175

$6.711

-

$6.442

$6.442

Parana Technologies

USA . 438 parts In-Stock

1+ parts

$21.895

100+ parts

-

1k+ parts

$22.386

10k+ parts

-

438

$21.895

-

$22.386

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$24.601

100+ parts

$23.371

1k+ parts

$22.141

10k+ parts

-

2,324

$24.601

$23.371

$22.141

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ChromeModa Solutions

Germany . 1,608 parts In-Stock

1+ parts

$24.601

100+ parts

$20.173

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1,608

$24.601

$20.173

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One Stop Electronics

USA . 899 parts In-Stock

1+ parts

$44.000

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899

$44.000

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Corphita

USA . 1,271 parts In-Stock

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1,271

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DigiPath Technology Company

USA . 1,118 parts In-Stock

1+ parts

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100+ parts

$22.180

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1,118

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$22.180

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Overview

Elevate your clock signal performance with the CDC222PAH by Texas Instruments. Crafted with precision and expertise, this clock driver and buffer boasts unmatched quality and reliability. Ideal for a range of applications, this product offers customers unparalleled value and benefits. Experience improved signal integrity and timing accuracy with the CDC222PAH, designed to meet the demands of today's technology-driven world. Trust in Texas Instruments for cutting-edge solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product a reliable choice for various applications.

Propagation Delay At Nominal Supply: 1.1 ns

With a fast propagation delay of 1.1 nanoseconds at nominal supply voltage, this clock driver/buffer ensures efficient and timely signal transmission.

Surface Mount: YES

Being surface mountable makes installation and integration easier, offering flexibility and space-saving benefits in electronic circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage of 3.3 volts, suitable for a wide range of electronic devices and systems.

No. of Terminals: 52

With 52 terminals, this clock driver/buffer provides ample connectivity options for interfacing with other components and peripherals in a circuit.

Maximum Operating Temperature: 70 °C

Capable of functioning reliably at temperatures up to 70°C, ensuring stability and performance in various operating conditions.

Technical Specifications

Clock Drivers & Buffers CDC222PAH attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G52

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

1.1 ns

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

CDC222PAH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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