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CDC208DWG4

Texas Instruments

CDC208DWG4 by Texas Instruments

CDC208DWG4 by Texas Instruments is a Clock Driver with 11.7ns Propagation Delay, 2 Functions, and 4 True Outputs. It operates at -40 to 85°C, suitable for industrial applications requiring a small outline package with standard input conditioning and true output polarity.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,199 parts In-Stock

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Digiode

USA . 52 parts In-Stock

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52

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Native Components

USA . 415 parts In-Stock

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$1.769

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-

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415

$1.769

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Northwest PG Solutions

USA . 2,310 parts In-Stock

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$1.946

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$1.946

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Andel Nordic

Denmark . 5,288 parts In-Stock

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$8.362

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$8.028

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$8.028

5,288

$8.362

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$8.028

AZTECH Wire

Italy . 896 parts In-Stock

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$12.184

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Parana Technologies

USA . 2,342 parts In-Stock

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$22.140

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$22.760

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$22.140

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DigiPath Technology Company

USA . 1,643 parts In-Stock

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$24.378

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$22.428

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1,643

$24.378

$22.428

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ChromeModa Solutions

Germany . 1,561 parts In-Stock

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$24.876

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$20.398

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IDEA Electronic Components Group

UK . 678 parts In-Stock

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$24.876

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$23.632

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$22.388

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678

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One Stop Electronics

USA . 946 parts In-Stock

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$37.000

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Corphita

USA . 4,203 parts In-Stock

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Overview

Elevate your electronics with the Texas Instruments CDC208DWG4 Clock Drivers & Buffers. Crafted with precision by a reputable manufacturer, this product offers top-notch quality and reliability. Ideal for a range of applications, this clock driver ensures smooth operation and optimal performance. Experience the value of fast propagation delay and true output polarity, providing seamless functionality for your devices. Upgrade to the CDC208DWG4 and unlock the benefits of cutting-edge technology in a compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of the clock driver & buffer durable and cost-effective.

Propagation Delay At Nominal Supply: 11.7 ns

The low propagation delay ensures accurate and fast clock signal distribution within the circuit.

Surface Mount: YES

Being surface mountable simplifies the PCB assembly process and saves space on the board.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals.

No. of Functions: 2

Having 2 functions in one device provides flexibility and saves board space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard voltage levels in most circuits.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable performance under varying load conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, it can withstand industrial operating environments.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85°C allows for reliable operation in various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for various applications.

Technical Specifications

Clock Drivers & Buffers CDC208DWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

208

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.7 ns

Propagation Delay (tpd):

11.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

60 MHz

Trade Compliance

CDC208DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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