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CDC209N

Texas Instruments

CDC209N by Texas Instruments

The Texas Instruments CDC209N clock driver has a propagation delay of 15.6 ns, 2 functions, and operates at a supply voltage of 5V. It is used in applications requiring precise timing control, such as industrial automation systems or communication equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,928 parts In-Stock

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Digiode

USA . 427 parts In-Stock

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427

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Prism Electronics

USA . 40 parts In-Stock

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Andel Nordic

Denmark . 2,991 parts In-Stock

1+ parts

$7.220

100+ parts

-

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$6.931

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$6.931

2,991

$7.220

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$6.931

$6.931

AZTECH Wire

Italy . 399 parts In-Stock

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$11.486

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399

$11.486

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One Stop Electronics

USA . 311 parts In-Stock

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$14.000

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311

$14.000

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Native Components

USA . 23 parts In-Stock

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$16.700

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23

$16.700

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Northwest PG Solutions

USA . 2,305 parts In-Stock

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$18.370

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$16.533

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$18.370

$16.533

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Parana Technologies

USA . 2,063 parts In-Stock

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$26.537

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$27.109

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2,063

$26.537

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DigiPath Technology Company

USA . 2,285 parts In-Stock

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$29.221

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$26.883

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$29.221

$26.883

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ChromeModa Solutions

Germany . 6,504 parts In-Stock

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$29.817

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$24.450

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

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$29.817

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$28.326

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$26.835

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1,682

$29.817

$28.326

$26.835

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Corphita

USA . 4,049 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Enhance your electronics projects with the Texas Instruments CDC209N Clock Drivers & Buffers. Manufactured with precision and quality in mind, this versatile component offers 2 functions with 4 bits each, true outputs, and a propagation delay of just 15.6 ns. Ideal for industrial applications, this product boasts a wide temperature range and 3-state output characteristics. With a nominal supply voltage of 5V and compatibility with both 3.3V and 5V power supplies, the CDC209N delivers reliable performance and flexibility. Upgrade your designs today with this high-quality clock driver from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product ideal for various applications.

Propagation Delay At Nominal Supply: 15.6 ns

Low propagation delay ensures efficient and fast operation of the clock drivers and buffers.

No. of Functions: 2

Having multiple functions in a single product increases its versatility and utility.

Nominal Supply Voltage / Vsup (V): 5

Compatible with a common supply voltage, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Designed to handle a standard load capacitance, ensuring reliable performance.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in controlling the output signals, enhancing the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Minimum fmax: 60 MHz

With a high maximum operating frequency, this product is suitable for high-speed applications.

Technical Specifications

Clock Drivers & Buffers CDC209N attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

209

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15.6 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Minimum fmax:

60 MHz

Trade Compliance

CDC209N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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