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CDC208NS

Texas Instruments

CDC208NS by Texas Instruments

CDC208NS by Texas Instruments is a Clock Driver & Buffer with 11.7ns Propagation Delay, 4 True Outputs, and 60MHz Min fmax. It is used in industrial applications for clock signal distribution due to its low delay and multiple output capabilities.

Median Price

$13.421

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,930 parts In-Stock

1+ parts

-

100+ parts

$11.930

1k+ parts

$10.680

10k+ parts

$10.050

6,930

-

$11.930

$10.680

$10.050

DigiKey

USA . 6,930 parts In-Stock

1+ parts

-

100+ parts

$15.700

1k+ parts

-

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6,930

-

$15.700

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Verical

USA . 2,618 parts In-Stock

1+ parts

-

100+ parts

$14.912

1k+ parts

$13.350

10k+ parts

$12.563

2,618

-

$14.912

$13.350

$12.563

Chip1Stop

Japan . 367 parts In-Stock

1+ parts

-

100+ parts

$8.166

1k+ parts

-

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367

-

$8.166

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,123 parts In-Stock

1+ parts

$8.166

100+ parts

-

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2,123

$8.166

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Digiode

USA . 1,971 parts In-Stock

1+ parts

$11.124

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-

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1,971

$11.124

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DigiKey Marketplace

USA . 7,030 parts In-Stock

1+ parts

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7,030

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Nova Conductors

Japan . 100 parts In-Stock

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100

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 8,532 parts In-Stock

1+ parts

$10.080

100+ parts

$9.480

1k+ parts

$7.600

10k+ parts

-

8,532

$10.080

$9.480

$7.600

-

Corphita

USA . 2,744 parts In-Stock

1+ parts

$10.539

100+ parts

-

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-

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2,744

$10.539

-

-

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Parana Technologies

USA . 653 parts In-Stock

1+ parts

$17.628

100+ parts

-

1k+ parts

$17.817

10k+ parts

-

653

$17.628

-

$17.817

-

DigiPath Technology Company

USA . 1,447 parts In-Stock

1+ parts

$19.411

100+ parts

$17.858

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-

10k+ parts

-

1,447

$19.411

$17.858

-

-

IDEA Electronic Components Group

UK . 2,082 parts In-Stock

1+ parts

$19.807

100+ parts

$18.817

1k+ parts

$17.826

10k+ parts

-

2,082

$19.807

$18.817

$17.826

-

ChromeModa Solutions

Germany . 802 parts In-Stock

1+ parts

$19.807

100+ parts

$16.242

1k+ parts

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802

$19.807

$16.242

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Corohmni

South Africa . 179 parts In-Stock

1+ parts

$25.754

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179

$25.754

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Microchip USA

USA . 2,480 parts In-Stock

1+ parts

$28.280

100+ parts

$27.880

1k+ parts

$27.670

10k+ parts

$27.470

2,480

$28.280

$27.880

$27.670

$27.470

Continental Prestige Electronics

USA . 3,609 parts In-Stock

1+ parts

-

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3,609

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,190 parts In-Stock

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Kepictronics

USA . 895 parts In-Stock

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895

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Aranea Global

USA . 50 parts In-Stock

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50

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Elevate your electronic designs with the CDC208NS Clock Drivers & Buffers by Texas Instruments. Crafted with precision and quality, this product offers unparalleled performance and reliability. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile component is sure to meet your needs. With fast propagation delay, low power consumption, and a wide temperature range, the CDC208NS delivers exceptional value and efficiency to every project. Choose Texas Instruments for cutting-edge technology and innovation that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Durable and reliable material for long-term use.

Propagation Delay At Nominal Supply 11.7 ns

Fast propagation delay ensures efficient operation.

Surface Mount YES

Easy installation and space-saving design.

Input Conditioning STANDARD

Compatible with various input signals.

No. of Functions 2

Provides flexibility and multiple functionalities.

Package Shape RECTANGULAR

Space-efficient design for compact applications.

Nominal Supply Voltage / Vsup (V) 5

Standard voltage requirement for easy integration.

Load Capacitance (CL) 50 pF

Optimized load capacitance for efficient performance.

Power Supplies (V) 5

Consistent power supply for stable operation.

No. of Terminals 20

Sufficient terminals for connectivity and control.

Package Style (Meter) SMALL OUTLINE

Compact size for space-constrained applications.

Maximum I (ol) 24 Amp

High output current capability for demanding tasks.

Propagation Delay (tpd) 11.7 ns

Low propagation delay for fast signal processing.

Maximum Operating Temperature 85 °C

Wide operating temperature range for versatile use.

Output Characteristics 3-STATE

Flexible output options for various configurations.

Minimum Operating Temperature -40 °C

Operational in extreme low-temperature conditions.

Terminal Finish NICKEL PALLADIUM GOLD

High-quality terminal finish for reliability.

Terminal Position DUAL

Dual terminal position for enhanced connectivity.

Maximum Seated Height 2 mm

Low profile design for compact installations.

Width 5.3 mm

Narrow width for space-saving applications.

Output Polarity TRUE

Correct signal polarity for accurate data transmission.

Minimum Supply Voltage (Vsup) 4.5 V

Operates at low supply voltage for power efficiency.

Maximum Time At Peak Reflow Temperature (s) 30

Resistant to high temperatures during reflow soldering.

Peak Reflow Temperature °C 260

High-temperature tolerance during manufacturing processes.

Length 12.6 mm

Optimal length for compact and efficient design.

Temperature Grade INDUSTRIAL

Suitable for industrial-level applications.

Technology CMOS

Uses CMOS technology for efficient operation.

Terminal Form GULL WING

Gull wing terminal form for secure connections.

Packing Method TUBE

Secure packaging method for transportation and storage.

Terminal Pitch 1.27 mm

Optimal terminal pitch for reliable connections.

Maximum Same Edge Skew (tskwd) 1 ns

Low skew for accurate timing control.

No. of True Outputs 4

Multiple true outputs for diverse applications.

Control Type ENABLE LOW

Enable low control type for efficient functionality.

Minimum fmax 60 MHz

High maximum frequency for fast data processing.

Maximum Supply Voltage (Vsup) 5.5 V

Safe operating range for supply voltage.

Maximum Power Supply Current (ICC) 0.08 mA

Low power supply current for energy efficiency.

Technical Specifications

Clock Drivers & Buffers CDC208NS attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

208

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.7 ns

Propagation Delay (tpd):

11.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Minimum fmax:

60 MHz

Trade Compliance

CDC208NS Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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