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CDC208NSG4

Texas Instruments

CDC208NSG4 by Texas Instruments

The Texas Instruments CDC208NSG4 clock driver has a propagation delay of 11.7 ns, operates at 5V, and offers 3-STATE output characteristics. It is used in industrial applications requiring precise timing control and features a small outline package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,678

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-

-

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Digiode

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,337

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,346 parts In-Stock

1+ parts

$2.291

100+ parts

-

1k+ parts

$2.199

10k+ parts

$2.199

3,346

$2.291

-

$2.199

$2.199

AZTECH Wire

Italy . 579 parts In-Stock

1+ parts

$13.399

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$13.399

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$19.326

100+ parts

$17.587

1k+ parts

$15.847

10k+ parts

-

2,000

$19.326

$17.587

$15.847

-

Parana Technologies

USA . 1,943 parts In-Stock

1+ parts

$21.875

100+ parts

-

1k+ parts

$22.366

10k+ parts

-

1,943

$21.875

-

$22.366

-

DigiPath Technology Company

USA . 211 parts In-Stock

1+ parts

$24.087

100+ parts

-

1k+ parts

-

10k+ parts

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211

$24.087

-

-

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ChromeModa Solutions

Germany . 5,381 parts In-Stock

1+ parts

$24.579

100+ parts

$20.155

1k+ parts

-

10k+ parts

-

5,381

$24.579

$20.155

-

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IDEA Electronic Components Group

UK . 1,175 parts In-Stock

1+ parts

$24.579

100+ parts

$23.350

1k+ parts

$22.121

10k+ parts

-

1,175

$24.579

$23.350

$22.121

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Corohmni

South Africa . 133 parts In-Stock

1+ parts

$33.967

100+ parts

-

1k+ parts

-

10k+ parts

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133

$33.967

-

-

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One Stop Electronics

USA . 241 parts In-Stock

1+ parts

$37.000

100+ parts

-

1k+ parts

-

10k+ parts

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241

$37.000

-

-

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Corphita

USA . 4,855 parts In-Stock

1+ parts

-

100+ parts

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4,855

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Microchip USA

USA . 1,696 parts In-Stock

1+ parts

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1,696

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Native Components

USA . 933 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.207

10k+ parts

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933

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-

$4.207

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Northwest PG Solutions

USA . 804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.251

10k+ parts

-

804

-

-

$4.251

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Overview

Enhance your electronic projects with the Texas Instruments CDC208NSG4 Clock Drivers & Buffers, a top-notch component designed to deliver exceptional performance and precision. Manufactured by Texas Instruments, a renowned leader in the industry, this product guarantees reliability and quality. Perfect for a wide range of applications, this clock driver boasts fast propagation delay and low power consumption, making it an ideal choice for demanding projects. Upgrade your designs with the CDC208NSG4 and experience unmatched efficiency and accuracy in your circuitry. Unlock the potential of your creations with this superior component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for a variety of applications.

Propagation Delay At Nominal Supply: 11.7 ns

The low propagation delay ensures fast and efficient signal processing in time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and enhancing reliability.

No. of Functions: 2

Multiple functions in a single device offer versatility and cost-effectiveness in system design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and allows for high-density mounting of components.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance states, facilitating bus sharing and reducing signal interference.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40°C to 85°C) makes the product suitable for a wide range of operating environments.

Technical Specifications

Clock Drivers & Buffers CDC208NSG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

208

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.7 ns

Propagation Delay (tpd):

11.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

60 MHz

Trade Compliance

CDC208NSG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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