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CDC2351DBG4

Texas Instruments

CDC2351DBG4 by Texas Instruments

Texas Instruments CDC2351DBG4 is a Clock Driver with 4.8ns Propagation Delay, suitable for applications requiring precise timing control. It operates at 3.3V, has 24 terminals, and supports Surface Mount installation. With BICMOS technology and 100MHz fmax, it ensures reliable performance in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,812

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-

-

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Vyrian

USA . 3,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,741

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,423 parts In-Stock

1+ parts

$12.259

100+ parts

-

1k+ parts

$12.684

10k+ parts

-

1,423

$12.259

-

$12.684

-

DigiPath Technology Company

USA . 1,785 parts In-Stock

1+ parts

$13.499

100+ parts

$12.419

1k+ parts

-

10k+ parts

-

1,785

$13.499

$12.419

-

-

ChromeModa Solutions

Germany . 2,844 parts In-Stock

1+ parts

$13.774

100+ parts

$11.295

1k+ parts

-

10k+ parts

-

2,844

$13.774

$11.295

-

-

IDEA Electronic Components Group

UK . 2,108 parts In-Stock

1+ parts

$13.774

100+ parts

$13.085

1k+ parts

$12.397

10k+ parts

-

2,108

$13.774

$13.085

$12.397

-

AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$16.928

100+ parts

-

1k+ parts

-

10k+ parts

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626

$16.928

-

-

-

One Stop Electronics

USA . 707 parts In-Stock

1+ parts

$44.000

100+ parts

-

1k+ parts

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10k+ parts

-

707

$44.000

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-

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Corphita

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

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3,265

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Native Components

USA . 962 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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962

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Northwest PG Solutions

USA . 961 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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961

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-

Overview

Enhance your devices with the CDC2351DBG4 clock driver and buffer by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications in various industries, this clock driver delivers seamless synchronization and timing accuracy. Experience the value of superior technology with fast propagation delays, 3-state output characteristics, and a compact design. Elevate your projects with the exceptional benefits and advantages that the CDC2351DBG4 brings to the table. Trust Texas Instruments to provide top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan and reliability.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures fast signal distribution, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and integration of this clock driver easy and convenient.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes this clock driver compatible with a wide range of systems and applications.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity and compatibility with various electronic devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this clock driver can withstand high temperature environments, ensuring stable performance.

Technology: BICMOS

Utilizing Bipolar-CMOS technology enables this clock driver to achieve high-speed operation and low power consumption, making it efficient and reliable.

Technical Specifications

Clock Drivers & Buffers CDC2351DBG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC2351DBG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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