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CC1180RSPT

Texas Instruments

CC1180RSPT by Texas Instruments

The Texas Instruments CC1180RSPT is a Telecom IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With CMOS technology and 3V supply voltage, it's ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,009 parts In-Stock

1+ parts

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4,009

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Digiode

USA . 241 parts In-Stock

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241

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 107 parts In-Stock

1+ parts

$6.280

100+ parts

-

1k+ parts

$7.034

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107

$6.280

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$7.034

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ChromeModa Solutions

Germany . 5,900 parts In-Stock

1+ parts

$7.056

100+ parts

$5.786

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5,900

$7.056

$5.786

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IDEA Electronic Components Group

UK . 133 parts In-Stock

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$7.056

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$6.350

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133

$7.056

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$6.350

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AZTECH Wire

Italy . 671 parts In-Stock

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$15.734

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671

$15.734

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Component Stockers USA

USA . 447 parts In-Stock

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$99.990

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447

$99.990

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Native Components

USA . 772 parts In-Stock

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$133.650

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$128.304

772

$133.650

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$128.304

Northwest PG Solutions

USA . 2,191 parts In-Stock

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$147.015

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$147.015

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One Stop Electronics

USA . 1,188 parts In-Stock

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$661.000

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$661.000

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Semicontronic

India . 1,211 parts In-Stock

1+ parts

$867.000

100+ parts

$845.325

1k+ parts

$840.990

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1,211

$867.000

$845.325

$840.990

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Ampacity Inc.

Singapore . 1,086 parts In-Stock

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$988.000

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1,086

$988.000

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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DigiPath Technology Company

USA . 2,043 parts In-Stock

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$6.362

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2,043

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$6.362

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Lixinc

USA . 1,991 parts In-Stock

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1,991

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Corphita

USA . 1,527 parts In-Stock

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1,527

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Corohmni

South Africa . 134 parts In-Stock

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134

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Overview

Unlock the potential of your telecom devices with the CC1180RSPT by Texas Instruments. Crafted with precision and expertise, this versatile IC offers exceptional performance and reliability for a wide range of applications. With its cutting-edge technology and industrial-grade design, the CC1180RSPT ensures seamless communication and connectivity. Experience the value and benefits of Texas Instruments' quality engineering with this innovative product. Elevate your telecom systems to new heights with the CC1180RSPT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB.

No. of Terminals: 36

Having 36 terminals provides ample connectivity options for various interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures functionality in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance.

Width: 6 mm

The compact width of 6mm allows for efficient use of PCB space.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and performance.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in telecom devices.

Technical Specifications

Other Function Telecom Interface ICs CC1180RSPT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1180RSPT Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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