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CC1121RHMR

Texas Instruments

CC1121RHMR by Texas Instruments

CC1121RHMR by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm, suitable for industrial applications requiring a compact chip carrier package with surface mount capability. The IC features nickel palladium gold finish and very thin profile, making it ideal for telecom circuit designs.

Median Price

$2.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 47,645 parts In-Stock

1+ parts

$2.390

100+ parts

$2.340

1k+ parts

$2.290

10k+ parts

-

47,645

$2.390

$2.340

$2.290

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,706

-

-

-

-

Digiode

USA . 3,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,935

-

-

-

-

Cyclops Electronics Ltd

UK . 727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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727

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 257 parts In-Stock

1+ parts

$8.775

100+ parts

-

1k+ parts

$9.459

10k+ parts

-

257

$8.775

-

$9.459

-

DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

$9.662

100+ parts

-

1k+ parts

-

10k+ parts

-

1,794

$9.662

-

-

-

ChromeModa Solutions

Germany . 5,013 parts In-Stock

1+ parts

$9.859

100+ parts

$8.084

1k+ parts

-

10k+ parts

-

5,013

$9.859

$8.084

-

-

IDEA Electronic Components Group

UK . 245 parts In-Stock

1+ parts

$9.859

100+ parts

$9.366

1k+ parts

$8.873

10k+ parts

-

245

$9.859

$9.366

$8.873

-

AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$16.995

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$16.995

-

-

-

One Stop Electronics

USA . 752 parts In-Stock

1+ parts

$813.000

100+ parts

-

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-

10k+ parts

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752

$813.000

-

-

-

Kepictronics

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

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25,000

-

-

-

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Lixinc

USA . 15,859 parts In-Stock

1+ parts

-

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15,859

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-

-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

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-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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-

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A-Z Elektronik GmbH

Germany . 2,868 parts In-Stock

1+ parts

-

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2,868

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Alle Elektronik GmbH

Germany . 1,912 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,912

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-

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Northwest PG Solutions

USA . 1,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.293

10k+ parts

-

1,840

-

-

$3.293

-

GreenTree Electronics

Israel . 727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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727

-

-

-

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Corphita

USA . 620 parts In-Stock

1+ parts

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620

-

-

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Native Components

USA . 85 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.259

10k+ parts

-

85

-

-

$3.259

-

Overview

Elevate your telecom applications with the CC1121RHMR by Texas Instruments, a top-of-the-line Other Function Telecom Interface IC. Crafted with precision and expertise, this product offers unmatched quality and reliability, ensuring superior performance in a wide range of scenarios. With its innovative design and advanced features, this IC delivers exceptional value and benefits to customers, making it the ideal choice for your next project. Trust Texas Instruments for cutting-edge technology that pushes the boundaries of what is possible. Elevate your designs with the CC1121RHMR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for use in a variety of applications.

Surface Mount: YES

Surface mount design allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during manufacturing and assembly processes.

Power Supplies (V): 3

Operating at a power supply of 3V makes this product energy-efficient and suitable for low-power applications.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and functionalities, making it versatile for different telecom interface applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile makes this package style efficient in dissipating heat and maintaining a compact design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The product can operate efficiently even in extremely low temperatures, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as terminal finish ensures high conductivity and corrosion resistance, extending the product's lifespan.

Terminal Position: QUAD

Having terminals in a quad position allows for easy connections and efficient signal transmission in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs CC1121RHMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1121RHMR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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