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BUF06704AIPWPRG4

Texas Instruments

BUF06704AIPWPRG4 by Texas Instruments

BUF06704AIPWPRG4 by Texas Instruments is a 6-function buffer amplifier with a max input offset voltage of 20000uV. Operating at temperatures from -25 to 85 °C, it has a nominal bandwidth of 1 MHz and amplifies signals with a slow rate of 1.6 V/us. Ideal for applications requiring precise signal buffering in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,960 parts In-Stock

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3,960

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Vyrian

USA . 2,696 parts In-Stock

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2,696

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Distributors (Availability)

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One Stop Electronics

USA . 1,495 parts In-Stock

1+ parts

$3.410

100+ parts

-

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1,495

$3.410

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Parana Technologies

USA . 484 parts In-Stock

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$5.954

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$6.736

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484

$5.954

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$6.736

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DigiPath Technology Company

USA . 1,702 parts In-Stock

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$6.556

100+ parts

$6.032

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1,702

$6.556

$6.032

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ChromeModa Solutions

Germany . 6,822 parts In-Stock

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$6.690

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$5.486

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6,822

$6.690

$5.486

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IDEA Electronic Components Group

UK . 241 parts In-Stock

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$6.690

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$6.021

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241

$6.690

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$6.021

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Native Components

USA . 909 parts In-Stock

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$9.490

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909

$9.490

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Northwest PG Solutions

USA . 2,315 parts In-Stock

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$10.439

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$9.395

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2,315

$10.439

$9.395

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AZTECH Wire

Italy . 356 parts In-Stock

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$14.619

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356

$14.619

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Component Stockers USA

USA . 529 parts In-Stock

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$99.990

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529

$99.990

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Corphita

USA . 1,509 parts In-Stock

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1,509

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Microchip USA

USA . 251 parts In-Stock

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Overview

Looking for top-quality buffer amplifiers that deliver exceptional performance across a wide range of applications? Look no further than the BUF06704AIPWPRG4 by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments has created a product that offers unparalleled value and benefits to customers. Whether you need to amplify signals, maintain impedance matching, or drive loads efficiently, this buffer amplifier with six functions is the perfect solution. Trust Texas Instruments to provide reliable, high-quality components for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the buffer amplifier.

Maximum Input Offset Voltage: 20000 uV

Ensures high precision and accuracy in signal amplification and buffering.

Nominal Bandwidth (3dB): 1 MHz

Offers a wide bandwidth for versatile applications in signal processing.

Technology: BIPOLAR

Utilizes bipolar technology for reliable and stable amplification performance.

Nominal Slow Rate: 1.6 V/us

Provides a moderate slew rate for smooth signal transitions without distortion.

Technical Specifications

Buffer Amplifiers BUF06704AIPWPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

6

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1 MHz

Nominal Slew Rate:

1.6 V/us

Input Offset Voltage Limit:

20 mV

Peak Bias Current:

200 pA

Operational Characteristics

Nominal Supply Voltage:

18 V

Maximum Supply Voltage:

19 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF06704AIPWPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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