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BUF04701AIDGSR

Texas Instruments

BUF04701AIDGSR by Texas Instruments

BUF04701AIDGSR by Texas Instruments is a CMOS buffer amplifier with a max input offset voltage of 7000 uV. It has a nominal bandwidth of 8 MHz and is suitable for automotive applications.

Median Price

$3.763

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Rochester

USA . 59,285 parts In-Stock

1+ parts

-

100+ parts

$3.010

1k+ parts

$2.690

10k+ parts

$2.540

59,285

-

$3.010

$2.690

$2.540

DigiKey

USA . 59,285 parts In-Stock

1+ parts

-

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$3.960

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59,285

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$3.960

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Verical

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

$3.763

1k+ parts

$3.362

10k+ parts

$3.175

32,500

-

$3.763

$3.362

$3.175

Distributors (In-Stock)

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Digiode

USA . 107 parts In-Stock

1+ parts

$2.764

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-

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107

$2.764

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$4.160

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750

$4.160

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Vyrian

USA . 7,332 parts In-Stock

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7,332

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VNN

France . 50 parts In-Stock

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50

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Prism Electronics

USA . 2 parts In-Stock

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Ampacity Inc.

Singapore . 49,039 parts In-Stock

1+ parts

$2.470

100+ parts

-

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49,039

$2.470

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Corphita

USA . 4,140 parts In-Stock

1+ parts

$2.619

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4,140

$2.619

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Parana Technologies

USA . 47 parts In-Stock

1+ parts

$3.035

100+ parts

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$3.546

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47

$3.035

-

$3.546

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DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$3.342

100+ parts

$3.074

1k+ parts

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695

$3.342

$3.074

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ChromeModa Solutions

Germany . 1,874 parts In-Stock

1+ parts

$3.410

100+ parts

$2.796

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1,874

$3.410

$2.796

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IDEA Electronic Components Group

UK . 155 parts In-Stock

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$3.410

100+ parts

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$3.069

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155

$3.410

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$3.069

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Netroflash

USA . 2,000 parts In-Stock

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$4.160

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2,000

$4.160

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Microchip USA

USA . 402 parts In-Stock

1+ parts

$18.720

100+ parts

$18.660

1k+ parts

$18.660

10k+ parts

$18.600

402

$18.720

$18.660

$18.660

$18.600

Perfect Parts

USA . 17,270 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,769 parts In-Stock

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11,769

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Kepictronics

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,846 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Overview

Experience superior performance and reliability with the BUF04701AIDGSR by Texas Instruments, a leading manufacturer in the industry. As a buffer amplifier, this product offers unmatched quality and versatility for your applications. With its compact design and small outline package shape, it is suitable for various electronic devices. Benefit from its low input offset voltage and minimal bias current, ensuring precision and accuracy in your circuitry. Whether you're working in automotive or industrial settings, trust this CMOS technology-enabled amplifier to deliver consistent results. Upgrade your projects today with the BUF04701AIDGSR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to environmental conditions, making this buffer amplifier suitable for various applications.

Maximum Input Offset Voltage: 7000 uV

With a high maximum input offset voltage, this buffer amplifier is capable of accurately amplifying small input signals, resulting in improved signal processing and increased accuracy.

Maximum Average Bias Current (IIB): 0.00001 uA

The extremely low maximum average bias current ensures minimal signal distortion and power consumption, making this buffer amplifier ideal for high precision and low power applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, simplifying the assembly process and overall system design.

No. of Functions: 4

With four available functions, this buffer amplifier offers versatility and flexibility in signal buffering applications, allowing for multiple input signals to be processed simultaneously.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, ensuring a secure and reliable connection, making it suitable for demanding environments.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with common power supply configurations, making this buffer amplifier widely applicable in various systems.

Power Supplies (V): 3.5/12

With support for multiple power supply voltages (3.5V and 12V), this buffer amplifier can be used in diverse circuit designs, accommodating a wide range of power requirements.

No. of Terminals: 10

The ample number of terminals provides flexibility in connectivity options, allowing for versatile integration and efficient signal routing in complex circuit layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allow for compact and space-saving designs, enabling higher density integration of buffer amplifiers in limited board areas.

Maximum Supply Voltage Limit: 6.6 V

The high maximum supply voltage limit ensures that the buffer amplifier can handle peak voltage levels without risk of damage or malfunction, enhancing overall system reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the buffer amplifier to withstand harsh operating conditions, ensuring stable and consistent performance even in demanding environments.

Maximum Bias Current (IIB) @25°C: 0.00001 uA

The extremely low maximum bias current at 25℃ ensures minimal signal distortion and power consumption, making this buffer amplifier highly efficient and reliable.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the buffer amplifier to function reliably in cold environments, making it suitable for diverse applications with extreme temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel palladium gold silver terminal finish ensures excellent electrical conductivity, corrosion resistance, and durability, ensuring long-term reliable performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in system interconnectivity, allowing for efficient and convenient integration into circuit designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact and space-efficient installation, enabling the buffer amplifier to be deployed in space-constrained applications.

Width: 3 mm

The compact width of 3mm allows for efficient board space utilization, enabling multiple buffer amplifiers to be placed closely, optimizing circuit density and functionality.

Nominal Bandwidth (3dB): 8 MHz

With a high nominal bandwidth, this buffer amplifier is capable of amplifying signals up to 8 MHz, allowing for accurate and reliable signal reproduction across a wide range of frequencies.

Maximum Time At Peak Reflow Temperature (s): 30

The buffer amplifier can withstand a maximum time of 30 seconds at peak reflow temperature, ensuring reliable solder joints and proper assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260℃, the buffer amplifier can withstand high-temperature soldering processes, ensuring proper and secure solder connections during assembly.

Length: 3 mm

The compact length of 3mm allows for efficient board space utilization, enabling multiple buffer amplifiers to be placed closely, optimizing circuit density and functionality.

Temperature Grade: AUTOMOTIVE

The buffer amplifier is designed and qualified for automotive applications, ensuring reliable performance in challenging automotive environments, making it an excellent choice for automotive electronic systems.

Maximum Negative Supply Voltage Limit: -6.6 V

The high maximum negative supply voltage limit accommodates negative power supply configurations, allowing for versatile power options in various circuit designs.

Technology: CMOS

With CMOS technology, this buffer amplifier offers low power consumption, high input impedance, and compatibility with various voltage levels, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering to printed circuit boards, ensuring reliable electrical connections during assembly and usage.

Amplifier Type: BUFFER

This product is a buffer amplifier, providing signal conditioning and impedance matching capabilities, enhancing the performance and integrity of signals in electronic systems.

Maximum Supply Current: 6.8 mA

The maximum supply current of 6.8 mA ensures efficient power usage while delivering reliable amplification, making this buffer amplifier suitable for low power and battery-operated applications.

Nominal Negative Supply Voltage (Vsup): -5 V

The nominal negative supply voltage of -5V allows for versatile power supply configurations, accommodating a wide range of circuit requirements.

Packing Method: TR

The use of tape and reel (TR) packing method facilitates automated assembly processes, ensuring efficient handling and protecting the buffer amplifiers during transportation and storage.

Nominal Slow Rate: 10 V/us

With a nominal slow rate of 10V/μs, this buffer amplifier provides efficient amplification of low-frequency signals, improving system response and accuracy in applications that require stable slow-changing signals.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact and dense component placement on printed circuit boards, enabling effective use of available board space in high-density designs.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this buffer amplifier can withstand moderate moisture exposure, ensuring long-term reliability and reducing the risk of moisture-induced failures.

Technical Specifications

Buffer Amplifiers BUF04701AIDGSR attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3.5/12 V

Total Functions:

4

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

8 MHz

Nominal Slew Rate:

10 V/us

Input Offset Voltage Limit:

7 mV

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Maximum Supply Current:

6.8 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP10,.19,20

Trade Compliance

BUF04701AIDGSR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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