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BUF06703PWRG4

Texas Instruments

BUF06703PWRG4 by Texas Instruments

BUF06703PWRG4 by Texas Instruments is a 16-terminal buffer amplifier in a small outline package with nickel palladium gold finish. With a peak reflow temperature of 260°C, it has a rectangular shape and gull wing terminal form. Ideal for applications requiring high-speed signal buffering in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,780

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Digiode

USA . 2,316 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,582 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

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1,582

$1.410

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-

-

Native Components

USA . 902 parts In-Stock

1+ parts

$1.880

100+ parts

-

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902

$1.880

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Northwest PG Solutions

USA . 1,156 parts In-Stock

1+ parts

$2.068

100+ parts

-

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1,156

$2.068

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Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

$2.989

10k+ parts

-

1,844

$2.498

-

$2.989

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DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$2.751

100+ parts

-

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10k+ parts

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2,214

$2.751

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ChromeModa Solutions

Germany . 3,743 parts In-Stock

1+ parts

$2.807

100+ parts

$2.302

1k+ parts

-

10k+ parts

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3,743

$2.807

$2.302

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$2.807

100+ parts

-

1k+ parts

$2.526

10k+ parts

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109

$2.807

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$2.526

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$5.438

100+ parts

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222

$5.438

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A-Z Elektronik GmbH

Germany . 6,878 parts In-Stock

1+ parts

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6,878

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Kepictronics

USA . 5,460 parts In-Stock

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5,460

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Corphita

USA . 4,893 parts In-Stock

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4,893

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Alle Elektronik GmbH

Germany . 4,585 parts In-Stock

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4,585

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Overview

Enhance your electronic designs with the top-quality BUF06703PWRG4 buffer amplifier from Texas Instruments. Known for their reliable and innovative products, Texas Instruments delivers exceptional performance in a compact package. Ideal for applications requiring signal buffering or impedance matching, this buffer amplifier offers unmatched value with its high-quality construction and superior functionality. Trust Texas Instruments to provide you with the best-in-class components for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to environmental factors, making this buffer amplifier suitable for various applications.

Surface Mount: YES

Being surface mountable, this buffer amplifier is easy to install on printed circuit boards, saving space and allowing for efficient integration in electronic systems.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, making it easier to place multiple buffer amplifiers on a PCB and enhancing overall system efficiency.

No. of Terminals: 16

With a high number of terminals, this buffer amplifier offers versatility in connectivity options, allowing for a wide range of configurations and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, maintaining signal integrity and reliability in diverse operating conditions.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm enables a slim profile and space-saving design, suitable for compact electronic devices and applications with height constraints.

Width: 4.4 mm

The narrow width of 4.4 mm contributes to the overall compactness of the buffer amplifier, allowing for dense PCB layouts and efficient use of space in electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this buffer amplifier can undergo reflow soldering processes quickly and effectively, ensuring reliable assembly and performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates the thermal stability of the buffer amplifier during soldering operations, making it suitable for lead-free soldering processes and high-temperature environments.

Length: 5 mm

The compact length of 5 mm contributes to the space-efficient design of the buffer amplifier, allowing for flexible placement on PCBs and compatibility with various electronic system layouts.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder joint connections, ensuring stable electrical contact and mechanical strength in the assembly of the buffer amplifier.

Amplifier Type: BUFFER

As a buffer amplifier, this product is designed to isolate input and output circuits, enhance signal strength, and minimize load effects, making it ideal for impedance matching and signal buffering applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for precise and compact soldering connections, enabling high-density mounting of the buffer amplifier on PCBs and efficient use of available space.

Technical Specifications

Buffer Amplifiers BUF06703PWRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

BUF06703PWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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